Issued Patents All Time
Showing 25 most recent of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417916 | Tin oxide films in semiconductor device manufacturing | Jengyi Yu, Yu Jiang, Hui-Jung Wu, Richard Wise, Yang Pan +2 more | 2025-09-16 |
| 12417902 | Method for cleaning a chamber | Ran Lin, Wenbing Yang, Tamal Mukherjee, Jengyi Yu, Yang Pan +1 more | 2025-09-16 |
| 12400842 | Method of cleaning chamber components with metal etch residues | Wenbing Yang, Ran Lin, Tamal Mukherjee, Chunhong Zhou, Xiaoyu Kang +2 more | 2025-08-26 |
| 12341021 | Selective etch using deposition of a metalloid or metal containing hardmask | Daniel Peter, Arunima Deya BALAN, Younghee Lee, Yang Pan | 2025-06-24 |
| 12278125 | Integrated dry processes for patterning radiation photoresist patterning | Jengyi Yu, Mohammed Haroon Alvi, Richard Wise, Yang Pan, Richard A. Gottscho +5 more | 2025-04-15 |
| 12266542 | Atomic layer etching for subtractive metal etch | Wenbing Yang, Mohand Brouri, Shih-Ked Lee, Yiwen FAN, Wook Choi +3 more | 2025-04-01 |
| 12256645 | Chemical etch nonvolatile materials for MRAM patterning | Wenbing Yang, Tamal Mukherjee, Zhongwei Zhu, Ran Lin, Yang Pan +2 more | 2025-03-18 |
| 12249514 | Carbon based depositions used for critical dimension control during high aspect ratio feature etches and for forming protective layers | Jon Henri, Karthik S. Colinjivadi, Francis Sloan Roberts, Kapu Sirish Reddy, Shih-Ked Lee +4 more | 2025-03-11 |
| 12211691 | Dry development of resists | Boris Volosskiy, Timothy Weidman, Chenghao Wu, Kevin Li Gu | 2025-01-28 |
| 12191125 | Removing metal contamination from surfaces of a processing chamber | Jengyi Yu, Seongjun Heo, Ge Yuan, Siva Kanakasabapathy | 2025-01-07 |
| 12183604 | Integrated dry processes for patterning radiation photoresist patterning | Jengyi Yu, Mohammed Haroon Alvi, Richard Wise, Yang Pan, Richard A. Gottscho +5 more | 2024-12-31 |
| 12183589 | Tin oxide mandrels in patterning | Jengyi Yu, Seongjun Heo, Boris Volosskiy, Sivananda K. Kanakasabapathy, Richard Wise +2 more | 2024-12-31 |
| 12119243 | Plasma etching chemistries of high aspect ratio features in dielectrics | Keren Jacobs Kanarik, Yang Pan, Jeffrey Marks | 2024-10-15 |
| 12105422 | Photoresist development with halide chemistries | Jengyi Yu, Da Li, Yiwen FAN, Yang Pan, Jeffrey Marks +5 more | 2024-10-01 |
| 12094711 | Tin oxide films in semiconductor device manufacturing | Jengyi Yu, Yu Jiang, Hui-Jung Wu, Richard Wise, Yang Pan +2 more | 2024-09-17 |
| 12080562 | Atomic layer etch and ion beam etch patterning | Tamal Mukherjee, Wenbing Yang, Girish Dixit, Yang Pan | 2024-09-03 |
| 12062537 | High etch selectivity, low stress ashable carbon hard mask | Jun Xue, Mary Anne Manumpil, Shih-Ked Lee | 2024-08-13 |
| 12037686 | Selective carbon deposition | Awnish Gupta, Adrien LaVoie, Bart J. van Schravendijk | 2024-07-16 |
| 12027375 | Selective etch using a sacrificial mask | Daniel Peter, Da Li, Jengyi Yu, Alexander Kabansky, Katie Lynn Nardi +1 more | 2024-07-02 |
| 11935758 | Atomic layer etching for subtractive metal etch | Wenbing Yang, Mohand Brouri, Shih-Ked Lee, Yiwen FAN, Wook Choi +3 more | 2024-03-19 |
| 11842888 | Removing metal contamination from surfaces of a processing chamber | Jengyi Yu, Seongjun Heo, Ge Yuan, Siva Kanakasabapathy | 2023-12-12 |
| 11670516 | Metal-containing passivation for high aspect ratio etch | Karthik S. Colinjivadi, Shih-Ked Lee, George Matamis, Yongsik Yu, Yang Pan +4 more | 2023-06-06 |
| 11594429 | Plasma etching chemistries of high aspect ratio features in dielectrics | Keren Jacobs Kanarik, Yang Pan, Jeffrey Marks | 2023-02-28 |
| 11521860 | Selectively etching for nanowires | Jun Xue, Mohand Brouri, Yuanhui Li, Daniel Peter, Alexander Kabansky | 2022-12-06 |
| 11450513 | Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials | Wenbing Yang, Tamal Mukherjee, Mohand Brouri, Yang Pan, Keren Jacobs Kanarik | 2022-09-20 |