LG

Lynne M. Gignac

IBM: 29 patents #3,528 of 70,183Top 6%
Overall (All Time): #128,218 of 4,157,543Top 4%
29
Patents All Time

Issued Patents All Time

Showing 1–25 of 29 patents

Patent #TitleCo-InventorsDate
12329044 Applying inert ion beam etching for improving a profile and repairing sidewall damage for phase change memory devices Luxherta Buzi, Thitima Suwannasiri, Robert L. Bruce, Sebastian U. Engelmann 2025-06-10
11820663 Crystalline film of carbon nanotubes Abram L. Falk, Damon B. Farmer 2023-11-21
10386409 Non-destructive determination of components of integrated circuits Chung-Ching Lin, Franco Stellari 2019-08-20
8889546 Discontinuous/non-uniform metal cap structure and process for interconnect integration Chih-Chao Yang, Chao-Kun Hu, Surbhi Mittal 2014-11-18
8866257 System involving electrically reprogrammable fuses Kaushik Chanda, Wai-Kin Ll, Ping-Chaun Wang 2014-10-21
8823176 Discontinuous/non-uniform metal cap structure and process for interconnect integration Chih-Chao Yang, Chao-Kun Hu, Surbhi Mittal 2014-09-02
8716071 Methods and systems involving electrically reprogrammable fuses Kaushik Chanda, Wai-Kin Li, Ping-Chuan Wang 2014-05-06
8679970 Structure and process for conductive contact integration Chih-Chao Yang 2014-03-25
8535991 Methods and systems involving electrically reprogrammable fuses Kaushik Chanda, Wai-Kin Li, Ping-Chuan Wang 2013-09-17
8133767 Efficient interconnect structure for electrical fuse applications Chih-Chao Yang, Chao-Kun Hu 2012-03-13
7893520 Efficient interconnect structure for electrical fuse applications Chih-Chao Yang, Chao-Kun Hu 2011-02-22
7767962 Method for SEM measurement of features using magnetically filtered low loss electron microscopy Oliver C. Wells 2010-08-03
7345305 Control of liner thickness for improving thermal cycle reliability Ronald G. Filippi, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore, Thomas M. Shaw +1 more 2008-03-18
7247946 On-chip Cu interconnection using 1 to 5 nm thick metal cap John Bruley, Roy A. Carruthers, Chao-Kun Hu, Eric G. Liniger, Sandra G. Malhotra +1 more 2007-07-24
7105817 Method of forming images in a scanning electron microscope Conal E. Murray, Oliver C. Wells 2006-09-12
6989282 Control of liner thickness for improving thermal cycle reliability Ronald G. Filippi, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore, Thomas M. Shaw +1 more 2006-01-24
6979393 Method for plating copper conductors and devices formed Kenneth P. Rodbell, Panayotis Andricacos, Cyril Cabral, Jr., Cyprian Emeka Uzoh, Peter S. Locke 2005-12-27
6784485 Diffusion barrier layer and semiconductor device containing same Stephan A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Paul C. Jamison +5 more 2004-08-31
6768111 Method for SEM measurement of topological features Oliver C. Wells, Jonathan Rullan, Conal E. Murray 2004-07-27
6570255 Method for forming interconnects on semiconductor substrates and structures formed Panayotis Andricacos, Cyril Cabral, Jr., John M. Cotte, Wilma Jean Horkans, Kenneth P. Rodbell 2003-05-27
6509265 Process for manufacturing a contact barrier Patrick W. DeHaven, Anthony G. Domenicucci, Glen L. Miles, Prabhat Tiwari, Yun-Yu Wang +2 more 2003-01-21
6448173 Aluminum-based metallization exhibiting reduced electromigration and method therefor Lawrence A. Clevenger, Ronald G. Filippi, Kenneth P. Rodbell, Roy Iggulden, Chao-Kun Hu +3 more 2002-09-10
6436823 Method for forming a TiN layer on top of a metal silicide layer in a semiconductor structure and structure formed Cyril Cabral, Jr., Chung-Ping Eng, Christian Lavoie, Patricia A. O'Neil, Kirk D. Peterson +3 more 2002-08-20
6429523 Method for forming interconnects on semiconductor substrates and structures formed Panayotis Andricacos, Cyril Cabral, Jr., John M. Cotte, Wilma Jean Horkans, Kenneth P. Rodbell 2002-08-06
6417567 Flat interface for a metal-silicon contract barrier film Anthony G. Domenicucci, Yun-Yu Wang, Horatio S. Wildman, Kwong Hon Wong, Roy A. Carruthers +2 more 2002-07-09