Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9607888 | Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling | Kai-Hung Yu, Toshio Hasegawa, Tadahiro Ishizaka, Manabu Oie, Fumitaka Amano +3 more | 2017-03-28 |
| 8722548 | Structures and techniques for atomic layer deposition | Shintaro Aoyama, Robert D. Clark, Steven P. Consiglio, Marinus Hopstaken, Hemanth Jagannathan +4 more | 2014-05-13 |
| 8580034 | Low-temperature dielectric formation for devices with strained germanium-containing channels | — | 2013-11-12 |
| 8460945 | Method for monitoring status of system components | David L. O'Meara, Daniel Craig Burdett, Stephen Cabral, John William Kostenko, Cory Wajda | 2013-06-11 |
| 8168548 | UV-assisted dielectric formation for devices with strained germanium-containing layers | — | 2012-05-01 |
| 7674710 | Method of integrating metal-containing films into semiconductor devices | Shigeo Ashigaki, Hideaki Yamasaki, Tomoyuki Sakoda, Mikio Suzuki, Genji Nakamura | 2010-03-09 |
| 7479454 | Method and processing system for monitoring status of system components | David L. O'Meara, Daniel Craig Burdett, Stephen Cabral, John William Kostenko, Cory Wajda | 2009-01-20 |
| 7419702 | Method for processing a substrate | Kazuhito Nakamura, Cory Wajda, Enrico Mosca, Yumiko Kawano, Fenton R. McFeely +1 more | 2008-09-02 |
| 7393761 | Method for fabricating a semiconductor device | Cory Wajda | 2008-07-01 |
| 7300891 | Method and system for increasing tensile stress in a thin film using multi-frequency electromagnetic radiation | Igeta Masonobu, Cory Wajda | 2007-11-27 |
| 7265066 | Method and system for increasing tensile stress in a thin film using collimated electromagnetic radiation | Igeta Masonobu, Cory Waida | 2007-09-04 |
| 7189431 | Method for forming a passivated metal layer | Hideaki Yamasaki, Kazuhito Nakamura, Yumiko Kawano, Fenton R. McFeely, Paul C. Jamison | 2007-03-13 |
| 7078341 | Method of depositing metal layers from metal-carbonyl precursors | Hideaki Yamasaki, Tsukasa Matsuda, Atsushi Gomi, Tatsuo Hatano, Masahito Sugiura +3 more | 2006-07-18 |
| 7067422 | Method of forming a tantalum-containing gate electrode structure | Kazuhito Nakamura, Hideaki Yamasaki, Yumiko Kawano, Fenton R. McFeely, John J. Yurkas +1 more | 2006-06-27 |
| 6992011 | Method and apparatus for removing material from chamber and wafer surfaces by high temperature hydrogen-containing plasma | Takenao Nemoto, Emmanuel Guidotti | 2006-01-31 |
| 6989321 | Low-pressure deposition of metal layers from metal-carbonyl precursors | Hideaki Yamasaki, Tsukasa Matsuda, Atsushi Gomi, Tatsuo Hatano, Masahito Sugiura +3 more | 2006-01-24 |
| 6924223 | Method of forming a metal layer using an intermittent precursor gas flow process | Hideaki Yamasaki, Tsukasa Matsuda, Atsushi Gomi, Tatsuo Hatano, Mitsuhiro Tachibana +6 more | 2005-08-02 |
| 6853953 | Method for characterizing the performance of an electrostatic chuck | Jozef Brcka, Bill D. Jones, Jeffrey Jay Long, Bill Oliver, Charles Tweed | 2005-02-08 |
| 6635569 | Method of passivating and stabilizing a Ti-PECVD process chamber and combined Ti-PECVD/TiN-CVD processing method and apparatus | Michael S. Ameen, Joseph T. Hillman, Michael G. Ward, Tugrul Yasar | 2003-10-21 |
| 5926737 | Use of TiCl.sub.4 etchback process during integrated CVD-Ti/TiN wafer processing | Michael S. Ameen, Joseph T. Hillman | 1999-07-20 |