VB

Veeraraghavan S. Basker

IBM: 426 patents #36 of 70,183Top 1%
Globalfoundries: 26 patents #104 of 4,424Top 3%
TE Tessera: 7 patents #62 of 271Top 25%
RE Renesas Electronics: 3 patents #1,322 of 4,529Top 30%
GU Globalfoundries U.S.: 3 patents #206 of 665Top 35%
AS Adeia Semiconductor Solutions: 2 patents #9 of 57Top 20%
SS Stmicroelectronics Sa: 1 patents #938 of 1,676Top 60%
ET Elpis Technologies: 1 patents #31 of 121Top 30%
FS Freeescale Semiconductor: 1 patents #2,021 of 3,767Top 55%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
📍 Schenectady, NY: #3 of 1,353 inventorsTop 1%
🗺 New York: #25 of 115,490 inventorsTop 1%
Overall (All Time): #452 of 4,157,543Top 1%
462
Patents All Time

Issued Patents All Time

Showing 51–75 of 462 patents

Patent #TitleCo-InventorsDate
11069809 Soi FinFET fins with recessed fins and epitaxy in source drain region Alexander Reznicek, Shogo Mochizuki, Nicolas L. Breil, Oleg Gluschenkov 2021-07-20
11056399 Source and drain EPI protective spacer during single diffusion break formation Yao Yao, Andrew M. Greene, Kangguo Cheng, Zhenxing Bi, Ruilong Xie 2021-07-06
11056386 Two-dimensional (2D) self-aligned contact (or via) to enable further device scaling Junli Wang, Chun-Chen Yeh, Alexander Reznicek 2021-07-06
11043451 Electrical fuse and/or resistor structures Kangguo Cheng, Ali Khakifirooz, Juntao Li 2021-06-22
11038041 Composite spacer enabling uniform doping in recessed fin devices Zuoguang Liu, Tenko Yamashita, Chun-Chen Yeh 2021-06-15
11024536 Contact interlayer dielectric replacement with improved SAC cap retention Adra Carr, Vimal Kamineni, Ruilong Xie, Andrew M. Greene, Nigel G. Cave 2021-06-01
11011422 Self-aligned wrap-around trench contacts 2021-05-18
11011417 Method and structure of metal cut Su Chen Fan, Ruilong Xie, Andrew M. Greene 2021-05-18
10998242 Semiconductor device including dual trench epitaxial dual-liner contacts Kangguo Cheng, Theodoras E. Standaert, Junli Wang 2021-05-04
10998234 Nanosheet bottom isolation and source or drain epitaxial growth Ruilong Xie, Nicolas Loubet, Balasubramanian Pranatharthiharan 2021-05-04
10998230 Fabrication of self-aligned gate contacts and source/drain contacts directly above gate electrodes and source/drains Kangguo Cheng, Theodorus E. Standaert, Junli Wang 2021-05-04
10991796 Source/drain contact depth control Lin Hu, Brian J. Greene, Kai Zhao, Daniel Jaeger, Keith H. Tabakman +1 more 2021-04-27
10971601 Replacement metal gate structures Kangguo Cheng, Theodorus E. Standaert, Junli Wang 2021-04-06
10957761 Electrical isolation for nanosheet transistor devices Chun-Chen Yeh, Alexander Reznicek, Junli Wang 2021-03-23
10943990 Gate contact over active enabled by alternative spacer scheme and claw-shaped cap Andrew M. Greene, Victor Chan, Gangadhara Raja Muthinti, Junli Wang, Kisik Choi +1 more 2021-03-09
10930754 Replacement metal gate structures Kangguo Cheng, Theodorus E. Standaert, Junli Wang 2021-02-23
10916660 Vertical transistor with a body contact for back-biasing Kangguo Cheng, Theodorus E. Standaert, Junli Wang 2021-02-09
10916471 Dual silicide liner flow for enabling low contact resistance Praneet Adusumilli, Zuoguang Liu, Tenko Yamashita, Chun-Chen Yeh 2021-02-09
10903338 Vertical FET with shaped spacer to reduce parasitic capacitance Junli Wang, Kangguo Cheng, Theodorus E. Standaert 2021-01-26
10896976 Embedded source/drain structure for tall FinFet and method of formation Kangguo Cheng, Ali Khakifirooz, Henry K. Utomo, Reinaldo Vega 2021-01-19
10892181 Semiconductor device with mitigated local layout effects Huimei Zhou, Gen Tsutsui, Andrew M. Greene, Dechao Guo, Huiming Bu +1 more 2021-01-12
10886363 Metal-insulator-metal capacitor structure Kangguo Cheng, Theodoras E. Standaert, Junli Wang 2021-01-05
10872809 Contact structures for integrated circuit products Ruilong Xie, Lars Liebmann, Balasubramanian S. Pranatharthi Haran 2020-12-22
10854733 Composite spacer enabling uniform doping in recessed fin devices Zuoguang Liu, Tenko Yamashita, Chun-Chen Yeh 2020-12-01
10840345 Source and drain contact cut last process to enable wrap-around-contact Andrew M. Greene, Dechao Guo, Tenko Yamashita, Robert R. Robison, Ardasheir Rahman 2020-11-17