RC

Richard A. Conti

IBM: 71 patents #1,021 of 70,183Top 2%
Infineon Technologies Ag: 5 patents #2,021 of 7,486Top 30%
NS Novellus Systems: 3 patents #254 of 780Top 35%
TL Tokyo Electron Limited: 2 patents #2,602 of 5,567Top 50%
Illinois Tool Works: 2 patents #1,548 of 4,258Top 40%
Applied Materials: 1 patents #4,780 of 7,310Top 70%
Samsung: 1 patents #49,284 of 75,807Top 70%
MI Morton International: 1 patents #302 of 580Top 55%
📍 Altamont, NY: #3 of 73 inventorsTop 5%
🗺 New York: #954 of 115,490 inventorsTop 1%
Overall (All Time): #25,548 of 4,157,543Top 1%
75
Patents All Time

Issued Patents All Time

Showing 51–75 of 75 patents

Patent #TitleCo-InventorsDate
6232222 Method of eliminating a critical mask using a blockout mask and a resulting semiconductor structure Michael D. Armacost, Jeffrey P. Gambino, Jeremy K. Stephens 2001-05-15
6208008 Integrated circuits having reduced stress in metallization Kenneth C. Arndt, David M. Dobuzinsky, Laertis Economikos, Jeffrey P. Gambino, Peter D. Hoh +1 more 2001-03-27
6177344 BPSG reflow method to reduce thermal budget for next generation device including heating in a steam ambient Li-Qun Xia, Maria Galiano, Ellie Yieh 2001-01-23
6159870 Borophosphosilicate glass incorporated with fluorine for low thermal budget gap fill Ashima B. Chakravarti, Frank V. Liucci, Darryl D. Restaino 2000-12-12
6114736 Controlled dopant diffusion and metal contamination in thin polycide gate conductor of MOSFET device Karanam Balasubramanyam, Stephen Bruce Brodsky, Badih El-Kareh 2000-09-05
6077786 Methods and apparatus for filling high aspect ratio structures with silicate glass Ashima B. Chakravarti, Donna R. Cote, Frank V. Liucci, Son V. Nguyen 2000-06-20
6049131 Device formed by selective deposition of refractory metal of less than 300 Angstroms of thickness Stephen Bruce Brodsky, Seshadri Subbanna 2000-04-11
6030881 High throughput chemical vapor deposition process capable of filling high aspect ratio structures George D. Papasouliotis, Ashima B. Chakravarti, Laertis Economikos, Patrick A. Van Cleemput 2000-02-29
5939335 Method for reducing stress in the metallization of an integrated circuit Kenneth C. Arndt, David M. Dobuzinsky, Laertis Economikos, Jeffrey P. Gambino, Peter D. Hoh +1 more 1999-08-17
5923999 Method of controlling dopant diffusion and metal contamination in thin polycide gate conductor of mosfet device Karanam Balasubramanyam, Stephen Bruce Brodsky, Badih El-Kareh 1999-07-13
5807788 Method for selective deposition of refractory metal and device formed thereby Stephen Bruce Brodsky, Seshadri Subbanna 1998-09-15
5728222 Apparatus for chemical vapor deposition of aluminum oxide Steven G. Barbee, Alexander Kostenko, Narayana V. Sarma, Donald L. Wilson, Justin W. Wong +1 more 1998-03-17
5665608 Method of aluminum oxide low pressure chemical vapor deposition (LPCVD) system-fourier transform infrared (FTIR) source chemical control Jonathan D. Chapple-Sokol, James A. O'Neill, Narayana V. Sarma, Donald L. Wilson, Justin W. Wong 1997-09-09
5648113 Aluminum oxide LPCVD system Steven G. Barbee, Jonathan D. Chapple-Sokol, Richard Hsiao, James A. O'Neill, Narayana V. Sarma +3 more 1997-07-15
5614247 Apparatus for chemical vapor deposition of aluminum oxide Steven G. Barbee, Alexander Kostenko, Narayana V. Sarma, Donald L. Wilson, Justin W. Wong +1 more 1997-03-25
5603988 Method for depositing a titanium or tantalum nitride or nitride silicide Michael J. Shapiro, Ravi Kanjolia, Ben C. Hui, Paul F. Seidler, Karen L. Holloway +1 more 1997-02-18
5540777 Aluminum oxide LPCVD system Steven G. Barbee, Jonathan D. Chapple-Sokol, Richard Hsiao, James A. O'Neill, Narayana V. Sarma +3 more 1996-07-30
5534066 Fluid delivery apparatus having an infrared feedline sensor James A. O'Neill, Michael L. Passow, Tina J. Cotler, Jonathan D. Chapple-Sokol, Jyothi Singh 1996-07-09
5492718 Fluid delivery apparatus and method having an infrared feedline sensor James A. O'Neill, Michael L. Passow, Tina J. Cotler, Jonathan D. Chapple-Sokol, Jyothi Singh 1996-02-20
5431734 Aluminum oxide low pressure chemical vapor deposition (LPCVD) system-fourier transform infrared (FTIR) source chemical control Jonathan D. Chapple-Sokol, James A. O'Neill, Narayana V. Sarma, Donald L. Wilson, Justin W. Wong 1995-07-11
5425810 Removable gas injectors for use in chemical vapor deposition of aluminium oxide David E. Kotecki, Donald L. Wilson, Justin W. Wong, Steven P. Zuhoski 1995-06-20
5383088 Storage capacitor with a conducting oxide electrode for metal-oxide dielectrics Jonathan D. Chapple-Sokol, Jeffrey P. Gambino 1995-01-17
5328868 Method of forming metal connections Kenneth L. DeVries, James F. White 1994-07-12
5268069 Safe method for etching silicon dioxide Jonathan D. Chapple-Sokol, David E. Kotecki, Andrew H. Simon, Manu J. Tejwani 1993-12-07
5134963 LPCVD reactor for high efficiency, high uniformity deposition Steven G. Barbee, Jonathan D. Chapple-Sokol, David E. Kotecki 1992-08-04