Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039366 | Method for providing rotationally symmetric alignment marks for an alignment system that requires asymmetric geometric layout | Holly LaFerrara, Alexander L. Martin, Martin E. Powell, Timothy J. Wiltshire, Roger J. Yerdon | 2011-10-18 |
| D502758 | Color coded nozzle | Noel Gomez | 2005-03-08 |
| 6803668 | Process-robust alignment mark structure for semiconductor wafers | Andrew Lu, Qiang Wu | 2004-10-12 |
| 6576550 | ‘Via first’ dual damascene process for copper metallization | Gabriela Brase, Uwe Schroeder | 2003-06-10 |
| 6461877 | Variable data compensation for vias or contacts | Kurt A. Tallman, Robert C. Wong | 2002-10-08 |
| 5603988 | Method for depositing a titanium or tantalum nitride or nitride silicide | Michael J. Shapiro, Ravi Kanjolia, Ben C. Hui, Paul F. Seidler, Richard A. Conti +1 more | 1997-02-18 |
| 5243222 | Copper alloy metallurgies for VLSI interconnection structures | James M. E. Harper, Thomas Yu-Kiu Kwok | 1993-09-07 |
| 5130274 | Copper alloy metallurgies for VLSI interconnection structures | James M. E. Harper, Thomas Yu-Kiu Kwok | 1992-07-14 |
| 4568632 | Patterning of polyimide films with far ultraviolet light | Samuel E. Blum, Rangaswamy Srinivasan | 1986-02-04 |