Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9054150 | Chip edge sealing | Markus Zundel, Peter Nelle, Guenther Schindler | 2015-06-09 |
| 7655563 | Method for preventing the formation of dentrites in a semiconductor | Martin Ostermayr, Erwin Ruderer | 2010-02-02 |
| 6841481 | Etching process for a two-layer metallization | Gregoire Grandremy | 2005-01-11 |
| 6812130 | Self-aligned dual damascene etch using a polymer | — | 2004-11-02 |
| 6576550 | ‘Via first’ dual damascene process for copper metallization | Uwe Schroeder, Karen L. Holloway | 2003-06-10 |
| 6521542 | Method for forming dual damascene structure | Mike Armacost, Bruno Spuler, Alois Gutmann | 2003-02-18 |