Issued Patents All Time
Showing 76–100 of 108 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6350692 | Increased polish removal rate of dielectric layers using fixed abrasive pads | Ravikumar Ramachandran, Alexander William Simpson | 2002-02-26 |
| 6335261 | Directional CVD process with optimized etchback | Wesley C. Natzle, Richard A. Conti, Thomas Ivers, George D. Papasouliotis | 2002-01-01 |
| 6319794 | Structure and method for producing low leakage isolation devices | Hiroyuki Akatsu, Tze-Chiang Chen, Herbert L. Ho, Richard L. Kleinhenz, Jack A. Mandelman +1 more | 2001-11-20 |
| 6294470 | Slurry-less chemical-mechanical polishing | Alexander William Simpson | 2001-09-25 |
| 6276246 | Method for punching slug from workpiece | Raschid J. Bezama, Mark J. LaPlante, David C. Long, Keith C. O'Neil | 2001-08-21 |
| 6218236 | Method of forming a buried bitline in a vertical DRAM device | Hussein I. Hanafi, Thomas S. Kanarsky, Cheruvu Murthy | 2001-04-17 |
| 6208008 | Integrated circuits having reduced stress in metallization | Kenneth C. Arndt, Richard A. Conti, David M. Dobuzinsky, Jeffrey P. Gambino, Peter D. Hoh +1 more | 2001-03-27 |
| 6198167 | Semiconductor structure exhibiting reduced contact resistance and method for fabrication | Johnathan E. Faltermeier, Byeongju Park | 2001-03-06 |
| 6180480 | Germanium or silicon-germanium deep trench fill by melt-flow process | Byeongju Park | 2001-01-30 |
| 6177696 | Integration scheme enhancing deep trench capacitance in semiconductor integrated circuit devices | Gary B. Bronner, Rajarao Jammy, Byeongju Park, Carl Radens, Martin Schrems | 2001-01-23 |
| 6149048 | Apparatus and method for use in manufacturing semiconductor devices | William Brearley, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra, Arthur G. Merryman +4 more | 2000-11-21 |
| 6136664 | Filling of high aspect ratio trench isolation | David E. Kotecki, Jack A. Mandelman | 2000-10-24 |
| 6099935 | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices | William Brearley, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra, Arthur G. Merryman +4 more | 2000-08-08 |
| 6057216 | Low temperature diffusion process for dopant concentration enhancement | Cheruvu Murthy, Hua Shen | 2000-05-02 |
| 6037193 | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | Mario J. Interrante, Lester W. Herron | 2000-03-14 |
| 6030881 | High throughput chemical vapor deposition process capable of filling high aspect ratio structures | George D. Papasouliotis, Ashima B. Chakravarti, Richard A. Conti, Patrick A. Van Cleemput | 2000-02-29 |
| 6003418 | Punched slug removal system | Raschid J. Bezama, Mark J. LaPlante, David C. Long, Keith C. O'Neil | 1999-12-21 |
| 5945735 | Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity | Lester W. Herron, Mario J. Interrante | 1999-08-31 |
| 5939335 | Method for reducing stress in the metallization of an integrated circuit | Kenneth C. Arndt, Richard A. Conti, David M. Dobuzinsky, Jeffrey P. Gambino, Peter D. Hoh +1 more | 1999-08-17 |
| 5907985 | Punch apparatus with improved slug removal efficiency | Raschid J. Bezama, Keith C. O'Neil | 1999-06-01 |
| 5904868 | Mounting and/or removing of components using optical fiber tools | Robert Hannon, Charles J. Hendricks, Richard P. Surprenant | 1999-05-18 |
| 5742021 | High thermal conductivity substrate and the method of brazing a cap thereto | Robert Hannon, Richard P. Surprenant, Thomas J. VanDuynhoven | 1998-04-21 |
| 5536605 | Method of repairing apertured laser metal mask | Rajesh S. Patel | 1996-07-16 |
| 5534371 | Repaired apertured laser metal mask | Rajesh S. Patel | 1996-07-09 |
| 5491319 | Laser ablation apparatus and method | Robert Hannon, Richard P. Surprenant | 1996-02-13 |