Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10293459 | Polishing pad having polishing surface with continuous protrusions | Paul Andre Lefevre, William C. Allison, Diane Scott, Ping Huang, Leslie M. Charns +2 more | 2019-05-21 |
| 10160092 | Polishing pad having polishing surface with continuous protrusions having tapered sidewalls | Paul Andre Lefevre, William C. Allison, Diane Scott, Ping Huang, Leslie M. Charns +2 more | 2018-12-25 |
| 9931728 | Polishing pad with foundation layer and polishing surface layer | William C. Allison, Diane Scott, Paul Andre Lefevre, James P. LaCasse | 2018-04-03 |
| 9649742 | Polishing pad having polishing surface with continuous protrusions | Paul Andre Lefevre, William C. Allison, Diane Scott, Ping Huang, Leslie M. Charns +2 more | 2017-05-16 |
| 9597769 | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer | Paul Andre Lefevre, William C. Allison, James P. LaCasse, Diane Scott, Ping Huang +1 more | 2017-03-21 |
| 9597777 | Homogeneous polishing pad for eddy current end-point detection | William C. Allison, Diane Scott, Ping Huang, Richard L. Frentzel | 2017-03-21 |
| 9211628 | Polishing pad with concentric or approximately concentric polygon groove pattern | William C. Allison, Diane Scott | 2015-12-15 |
| 9067297 | Polishing pad with foundation layer and polishing surface layer | William C. Allison, Diane Scott, Paul Andre Lefevre, James P. LaCasse | 2015-06-30 |
| 9028302 | Polishing pad for eddy current end-point detection | William C. Allison, Diane Scott, Ping Huang, Richard L. Frentzel | 2015-05-12 |
| 8657653 | Homogeneous polishing pad for eddy current end-point detection | William C. Allison, Diane Scott, Ping Huang, Richard L. Frentzel | 2014-02-25 |
| 8628384 | Polishing pad for eddy current end-point detection | William C. Allison, Diane Scott, Ping Huang, Richard L. Frentzel | 2014-01-14 |
| 8439994 | Method of fabricating a polishing pad with an end-point detection region for eddy current end-point detection | William C. Allison, Diane Scott, Ping Huang, Richard L. Frentzel | 2013-05-14 |
| 7582127 | Polishing composition for a tungsten-containing substrate | Robert Vacassy, Dinesh N. Khanna | 2009-09-01 |
| 7247567 | Method of polishing a tungsten-containing substrate | Robert Vacassy, Dinesh N. Khanna | 2007-07-24 |
| 7011574 | Polyelectrolyte dispensing polishing pad | Ronald J. Schutz | 2006-03-14 |
| 6932674 | Method of determining the endpoint of a planarization process | Peter Lahnor, Olaf Kuehn, Andreas Roemer | 2005-08-23 |
| 6899597 | Chemical mechanical polishing (CMP) process using fixed abrasive pads | Peter Wrschka | 2005-05-31 |
| 6893968 | Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devices | Peter Lahnor | 2005-05-17 |
| 6841480 | Polyelectrolyte dispensing polishing pad, production thereof and method of polishing a substrate | Ronald J. Schutz | 2005-01-11 |
| 6827635 | Method of planarizing substrates | Peter Lahnor, Olaf Kuehn, Andreas Roemer | 2004-12-07 |
| 6740539 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee +3 more | 2004-05-25 |
| 6569769 | Slurry-less chemical-mechanical polishing | Laertis Economikos, Ravikumar Ramachandran | 2003-05-27 |
| 6570256 | Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substrates | Richard A. Conti, Prakash Dev, David M. Dobuzinsky, Daniel C. Edelstein, Gill Yong Lee +3 more | 2003-05-27 |
| 6485355 | Method to increase removal rate of oxide using fixed-abrasive | Laertis Economikos | 2002-11-26 |
| 6350692 | Increased polish removal rate of dielectric layers using fixed abrasive pads | Laertis Economikos, Ravikumar Ramachandran | 2002-02-26 |