Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11938584 | Chemical mechanical planarization pads with constant groove volume | Devin Schmitt, Jaeseok Lee, Eric Scott Moyer, Holland Hodges | 2024-03-26 |
| 11440158 | Coated compressive subpad for chemical mechanical polishing | Diane Scott | 2022-09-13 |
| 10946495 | Low density polishing pad | Ping Huang, William C. Allison, Richard L. Frentzel, Robert Kerprich, Diane Scott | 2021-03-16 |
| 10293459 | Polishing pad having polishing surface with continuous protrusions | William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns +2 more | 2019-05-21 |
| 10160092 | Polishing pad having polishing surface with continuous protrusions having tapered sidewalls | William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns +2 more | 2018-12-25 |
| 9931728 | Polishing pad with foundation layer and polishing surface layer | William C. Allison, Diane Scott, James P. LaCasse, Alexander William Simpson | 2018-04-03 |
| 9931729 | Polishing pad with grooved foundation layer and polishing surface layer | William C. Allison, Diane Scott, James P. LaCasse | 2018-04-03 |
| 9868185 | Polishing pad with foundation layer and window attached thereto | William C. Allison, Diane Scott, Jose I. Arno | 2018-01-16 |
| 9796063 | Multi-layered chemical-mechanical planarization pad | Anoop Mathew, Guangwei Wu, Scott Xin Qiao, Oscar K. Hsu, David Adam Wells +2 more | 2017-10-24 |
| 9649742 | Polishing pad having polishing surface with continuous protrusions | William C. Allison, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns +2 more | 2017-05-16 |
| 9597769 | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer | William C. Allison, James P. LaCasse, Diane Scott, Alexander William Simpson, Ping Huang +1 more | 2017-03-21 |
| 9238294 | Polishing pad having porogens with liquid filler | William C. Allison | 2016-01-19 |
| 9162341 | Chemical-mechanical planarization pad including patterned structural domains | Anoop Mathew, Scott Xin Qiao, Guangwei Wu, David Adam Wells, Oscar K. Hsu | 2015-10-20 |
| 9067297 | Polishing pad with foundation layer and polishing surface layer | William C. Allison, Diane Scott, James P. LaCasse, Alexander William Simpson | 2015-06-30 |
| 9067298 | Polishing pad with grooved foundation layer and polishing surface layer | William C. Allison, Diane Scott, James P. LaCasse | 2015-06-30 |
| 8790165 | Multi-layered chemical-mechanical planarization pad | Anoop Mathew, Guangwei Wu, Scott Xin Qiao, Oscar K. Hsu, David Adam Wells +2 more | 2014-07-29 |
| 8758659 | Method of grooving a chemical-mechanical planarization pad | Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Guangwei Wu +1 more | 2014-06-24 |
| 8684794 | Chemical mechanical planarization pad with void network | Oscar K. Hsu, David Adam Wells, Scott Xin Qiao, Anoop Mathew, Guangwei Wu | 2014-04-01 |
| 8546260 | Fabric containing non-crimped fibers and methods of manufacture | Oscar K. Hsu | 2013-10-01 |
| 8491360 | Three-dimensional network in CMP pad | Oscar K. Hsu, David Adam Wells, Marc C. Jin, John Erik Aldeborgh | 2013-07-23 |
| 8435099 | Chemical-mechanical planarization pad including patterned structural domains | Anoop Mathew, Scott Xin Qiao, Guangwei Wu, David Adam Wells, Oscar K. Hsu | 2013-05-07 |
| 8430721 | Chemical-mechanical planarization pad | Oscar K. Hsu, Marc C. Jin, John Erik Aldeborgh, David Adam Wells | 2013-04-30 |
| 8377351 | Polishing pad with controlled void formation | David Adam Wells, Marc C. Jin, Oscar K. Hsu, John Erik Aldeborgh, Scott Xin Qiao +2 more | 2013-02-19 |
| 8172648 | Chemical-mechanical planarization pad | Oscar K. Hsu, Marc C. Jin, John Erik Aldeborgh, David Adam Wells | 2012-05-08 |
| 7985121 | Chemical-mechanical planarization pad having end point detection window | Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin | 2011-07-26 |