| 10946495 |
Low density polishing pad |
Ping Huang, Richard L. Frentzel, Paul Andre Lefevre, Robert Kerprich, Diane Scott |
2021-03-16 |
$57,299,000 |
| 10293459 |
Polishing pad having polishing surface with continuous protrusions |
Paul Andre Lefevre, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns +2 more |
2019-05-21 |
$7,272,000 |
| 10160092 |
Polishing pad having polishing surface with continuous protrusions having tapered sidewalls |
Paul Andre Lefevre, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns +2 more |
2018-12-25 |
|
| 9931728 |
Polishing pad with foundation layer and polishing surface layer |
Diane Scott, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson |
2018-04-03 |
$7,951,000 |
| 9931729 |
Polishing pad with grooved foundation layer and polishing surface layer |
Paul Andre Lefevre, Diane Scott, James P. LaCasse |
2018-04-03 |
$7,951,000 |
| 9868185 |
Polishing pad with foundation layer and window attached thereto |
Paul Andre Lefevre, Diane Scott, Jose I. Arno |
2018-01-16 |
$17,842,000 |
| 9649742 |
Polishing pad having polishing surface with continuous protrusions |
Paul Andre Lefevre, Alexander William Simpson, Diane Scott, Ping Huang, Leslie M. Charns +2 more |
2017-05-16 |
|
| 9597770 |
Method of fabricating a polishing |
Diane Scott, Rajeev Bajaj |
2017-03-21 |
|
| 9597769 |
Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
Paul Andre Lefevre, James P. LaCasse, Diane Scott, Alexander William Simpson, Ping Huang +1 more |
2017-03-21 |
|
| 9597777 |
Homogeneous polishing pad for eddy current end-point detection |
Diane Scott, Ping Huang, Richard L. Frentzel, Alexander William Simpson |
2017-03-21 |
|
| 9555518 |
Polishing pad with multi-modal distribution of pore diameters |
Ping Huang, Diane Scott, James P. LaCasse |
2017-01-31 |
|
| 9333577 |
Electro discharge machining apparatus and method |
Peng Li, Bin Wei, Huiya Xu, Mark Joseph Gleason, Jeffrey F. Wessels +1 more |
2016-05-10 |
$20,337,000 |
| 9296085 |
Polishing pad with homogeneous body having discrete protrusions thereon |
Rajeev Bajaj, Ping Huang, Robert Kerprich, Richard L. Frentzel, Diane Scott |
2016-03-29 |
|
| 9249273 |
Polishing pad with alignment feature |
Robert Kerprich, Diane Scott |
2016-02-02 |
|
| 9238294 |
Polishing pad having porogens with liquid filler |
Paul Andre Lefevre |
2016-01-19 |
|
| 9211628 |
Polishing pad with concentric or approximately concentric polygon groove pattern |
Diane Scott, Alexander William Simpson |
2015-12-15 |
|
| 9156124 |
Soft polishing pad for polishing a semiconductor substrate |
Diane Scott, Robert Kerprich, Ping Huang, Richard L. Frentzel |
2015-10-13 |
|
| 9067297 |
Polishing pad with foundation layer and polishing surface layer |
Diane Scott, Paul Andre Lefevre, James P. LaCasse, Alexander William Simpson |
2015-06-30 |
|
| 9067298 |
Polishing pad with grooved foundation layer and polishing surface layer |
Paul Andre Lefevre, Diane Scott, James P. LaCasse |
2015-06-30 |
|
| 9028302 |
Polishing pad for eddy current end-point detection |
Diane Scott, Ping Huang, Richard L. Frentzel, Alexander William Simpson |
2015-05-12 |
|
| 9017140 |
CMP pad with local area transparency |
Ping Huang, Diane Scott, Richard L. Frentzel, Robert Kerprich |
2015-04-28 |
|
| 8968058 |
Polishing pad with alignment feature |
Robert Kerprich, Diane Scott |
2015-03-03 |
|
| 8920219 |
Polishing pad with alignment aperture |
Diane Scott, Rajeev Bajaj |
2014-12-30 |
|
| 8702479 |
Polishing pad with multi-modal distribution of pore diameters |
Ping Huang, Diane Scott, James P. LaCasse |
2014-04-22 |
|
| 8657653 |
Homogeneous polishing pad for eddy current end-point detection |
Diane Scott, Ping Huang, Richard L. Frentzel, Alexander William Simpson |
2014-02-25 |
|
