Issued Patents All Time
Showing 51–71 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8123860 | Apparatus for cyclical depositing of thin films | Randhir P. S. Thakur, Alfred Mak, Ming Xi, Walter Glenn, Ahmad Khan +2 more | 2012-02-28 |
| 7838441 | Deposition and densification process for titanium nitride barrier layers | Amit Khandelwal, Christophe Marcadal, Mei Chang | 2010-11-23 |
| 7779784 | Apparatus and method for plasma assisted deposition | Chen-An Chen, Michael Yang, Ming Xi, Mark Hytros | 2010-08-24 |
| 7745333 | Methods for depositing tungsten layers employing atomic layer deposition techniques | Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Madhu Moorthy, Srinivas Gandikota +9 more | 2010-06-29 |
| 7732327 | Vapor deposition of tungsten materials | Sang-Hyeob Lee, Kai Wu, Amit Khandelwal, Ross Marshall, Emily Renuart +2 more | 2010-06-08 |
| 7691442 | Ruthenium or cobalt as an underlayer for tungsten film deposition | Srinivas Gandikota, Madhu Moorthy, Amit Khandelwal, Mei Chang, Kavita Shah +1 more | 2010-04-06 |
| 7605083 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Mei Chang +7 more | 2009-10-20 |
| 7521379 | Deposition and densification process for titanium nitride barrier layers | Amit Khandelwal, Christophe Marcadal, Mei Chang | 2009-04-21 |
| 7514353 | Contact metallization scheme using a barrier layer over a silicide layer | Timothy Weidman, Kapila Wijekoon, Zhize Zhu, Amit Khandelwal, Arulkumar Shanmugasundram +3 more | 2009-04-07 |
| 7429402 | Ruthenium as an underlayer for tungsten film deposition | Srinivas Gandikota, Madhu Moorthy, Amit Khandelwal, Mei Chang, Kavita Shah +1 more | 2008-09-30 |
| 7384867 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Mei Chang +7 more | 2008-06-10 |
| 7175713 | Apparatus for cyclical deposition of thin films | Randhir P. S. Thakur, Alfred Mak, Ming Xi, Walter Glenn, Ahmad Khan +2 more | 2007-02-13 |
| 6998014 | Apparatus and method for plasma assisted deposition | Chen-An Chen, Michael Yang, Ming Xi, Mark Hytros | 2006-02-14 |
| 6939804 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Mei Chang +7 more | 2005-09-06 |
| 6827815 | Showerhead assembly for a processing chamber | Mark Hytros, Truc T. Tran, Hongbee Teoh, Lawrence Chung-Lai Lei, Salvador P. Umotoy | 2004-12-07 |
| 6174810 | Copper interconnect structure and method of formation | Rabiul Islam, Kevin Lucas, Stanley M. Filipiak, Ramnath Venkatraman | 2001-01-16 |
| 5447887 | Method for capping copper in semiconductor devices | Stanley M. Filipiak | 1995-09-05 |
| 5391517 | Process for forming copper interconnect structure | Robert W. Fiordalice | 1995-02-21 |
| 5324690 | Semiconductor device having a ternary boron nitride film and a method for forming the same | Stephen S. Poon | 1994-06-28 |
| 5275973 | Method for forming metallization in an integrated circuit | — | 1994-01-04 |
| 5064683 | Method for polish planarizing a semiconductor substrate by using a boron nitride polish stop | Stephen S. Poon | 1991-11-12 |