Issued Patents 2022
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355474 | Semiconductor package and method manufacturing the same | Feng-Cheng Hsu | 2022-06-07 |
| 11348889 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Chih-Hang Tung, Cheng-Chang Wei | 2022-05-31 |
| 11342306 | Multi-chip wafer level packages | Shuo-Mao Chen, Feng-Cheng Hsu, Han-Hsiang Huang, Hsien-Wen Liu, Hsiao-Wen Lee | 2022-05-24 |
| 11342255 | Semiconductor structure and manufacturing method thereof | Shuo-Mao Chen, Feng-Cheng Hsu | 2022-05-24 |
| 11335672 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2022-05-17 |
| 11329031 | Structure and formation method for chip package | Jui-Pin Hung, Cheng-Lin Huang, Hsien-Wen Liu | 2022-05-10 |
| 11328971 | Semiconductor device and method of manufacture | Shu-Shen Yeh, Po-Yao Lin, Shyue-Ter Leu, Chih-Kung Huang, Tsung-Ming Yeh | 2022-05-10 |
| 11322447 | Dual-sided routing in 3D SiP structure | Po-Hao Tsai, Po-Yao Chuang, Meng-Liang Lin, Yi-Wen Wu, Techi Wong | 2022-05-03 |
| 11322449 | Package with fan-out structures | Po-Hao Tsai, Po-Yao Chuang, Techi Wong | 2022-05-03 |
| 11302650 | Package structure and method of fabricating the same | Yi-Wen Wu, Shih-Ting Hung, Po-Yao Chuang | 2022-04-12 |
| 11296065 | Semiconductor packages and methods of forming same | Techi Wong, Po-Yao Chuang, Shuo-Mao Chen, Meng-Wei Chou | 2022-04-05 |
| 11295957 | Package structure and method of manufacturing the same | Feng-Cheng Hsu, Shuo-Mao Chen | 2022-04-05 |
| 11282759 | Chip package structure having warpage control and method of forming the same | Feng-Cheng Hsu, Shuo-Mao Chen | 2022-03-22 |
| 11282803 | Device, semiconductor package and method of manufacturing semiconductor package | Chia-Kuei Hsu, Ming-Chih Yew, Po-Hao Tsai, Po-Yao Lin | 2022-03-22 |
| 11282756 | Organic interposer including stress-resistant bonding structures and methods of forming the same | Tsung-Yen Lee, Chin-Hua Wang, Ming-Chih Yew, Chia-Kuei Hsu, Po-Chen Lai +1 more | 2022-03-22 |
| 11270975 | Semiconductor packages including passive devices and methods of forming same | Po-Yao Chuang, Shuo-Mao Chen | 2022-03-08 |
| 11270953 | Structure and formation method of chip package with shielding structure | Po-Yao Chuang, Po-Hao Tsai, Shuo-Mao Chen, Ming-Chih Yew | 2022-03-08 |
| 11264359 | Chip bonded to a redistribution structure with curved conductive lines | Chia-Kuei Hsu, Ming-Chih Yew, Shu-Shen Yeh, Che-Chia Yang, Po-Yao Lin | 2022-03-01 |
| 11264300 | Package structure with lid and method for forming the same | Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Chin-Hua Wang | 2022-03-01 |
| 11251142 | Method of fabricating package structure | Chia-Hsiang Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Arunima Banerjee | 2022-02-15 |
| 11251054 | Integrated passive device package and methods of forming same | Feng-Cheng Hsu, Shuo-Mao Chen, Jui-Pin Hung | 2022-02-15 |
| 11239194 | Chip package structure | Shuo-Mao Chen, Feng-Cheng Hsu | 2022-02-01 |
| 11239173 | Structure and formation method of chip package with fan-out feature | Po-Hao Tsai, Meng-Liang Lin, Po-Yao Chuang, Techi Wong | 2022-02-01 |