Issued Patents 2018
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014260 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ching-Hua Hsieh +1 more | 2018-07-03 |
| 9997483 | Ball amount process in the manufacturing of integrated circuit | Hsien-Wei Chen, Tsung-Yuan Yu, Wen-Hsiung Lu | 2018-06-12 |
| 9991190 | Packaging with interposer frame | Hui-Min Huang, Yen-Chang Hu, Chih-Wei Lin, Chung-Shi Liu, Chen-Shien Chen | 2018-06-05 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Hsiu-Jen Lin, Chun-Cheng Lin, Chih-Wei Lin, Ching-Hua Hsieh +1 more | 2018-05-22 |
| 9978656 | Mechanisms for forming fine-pitch copper bump structures | Tsung-Shu Lin, Han-Ping Pu, Chang-Chia Huang, Hao-Juin Liu | 2018-05-22 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Kuo Lung Pan +3 more | 2018-04-17 |
| 9941221 | Warpage control in package-on-package structures | Wei-Yu Chen, Yu-Hsiang Hu, Wei-Hung Lin, Chung-Shi Liu | 2018-04-10 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen +1 more | 2018-04-03 |
| 9935091 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Chung-Shi Liu | 2018-04-03 |
| 9935070 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Chung-Shi Liu | 2018-04-03 |
| 9935067 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen, Wei-Yu Chen | 2018-04-03 |
| 9929071 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Chung-Shi Liu, Hsiu-Jen Lin, Hsien-Wei Chen +1 more | 2018-03-27 |
| 9911674 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2018-03-06 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin | 2018-03-06 |
| 9911633 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Hsiu-Jen Lin, Wei-Hung Lin, Chung-Shi Liu | 2018-03-06 |
| 9899248 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin, Hung-Jui Kuo, Yu-Hsiang Hu | 2018-02-20 |
| 9892962 | Wafer level chip scale package interconnects and methods of manufacture thereof | Cheng-Tar Wu, Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Chun-Cheng Lin | 2018-02-13 |
| 9888527 | Systems for processing semiconductor devices, and methods of processing semiconductor devices | Hsiu-Jen Lin, Wei-Yu Chen, Ai-Tee Ang, Chung-Shi Liu | 2018-02-06 |
| 9887162 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin | 2018-02-06 |
| 9881888 | Manufacturing method of interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Chih-Hang Tung, Chung-Shi Liu | 2018-01-30 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Hsiu-Jen Lin, Ching-Hua Hsieh +2 more | 2018-01-30 |
| 9871018 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Hui-Min Huang, Wei-Hung Lin | 2018-01-16 |
| 9865574 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Chung-Shi Liu | 2018-01-09 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Meng-Tse Chen, Chih-Wei Lin +3 more | 2018-01-02 |