Issued Patents 2016
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9418978 | Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon | Chen-Hua Yu, Mirng-Ji Lii, Ming-Da Cheng, Chih-Wei Lin | 2016-08-16 |
| 9418955 | Plasma treatment for semiconductor devices | Chen-Fa Lu, Chen-Hua Yu, Wei-Yu Chen, Cheng-Ting Chen | 2016-08-16 |
| 9412717 | Apparatus and methods for molded underfills in flip chip packaging | Meng-Tse Chen, Hsiu-Jen Lin, Chun-Cheng Lin, Wen-Hsiung Lu, Ming-Da Cheng | 2016-08-09 |
| 9412723 | Package on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng | 2016-08-09 |
| 9412689 | Semiconductor packaging structure and method | Chun-Cheng Lin, Kuei-Wei Huang, Cheng-Ting Chen, Wei-Hung Lin, Ming-Da Cheng | 2016-08-09 |
| 9406776 | High temperature gate replacement process | Chen-Hua Yu | 2016-08-02 |
| 9401337 | Molding structure for wafer level package | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2016-07-26 |
| 9397062 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Meng-Tse Chen, Wei-Hung Lin, Ming-Da Cheng | 2016-07-19 |
| 9397080 | Package on package devices and methods of packaging semiconductor dies | Chun-Lei Hsu, Yu-Feng Chen, Ming-Che Ho, De-Yuan Lu | 2016-07-19 |
| 9385040 | Method of manufacturing a semiconductor device | Tsai-Tsung Tsai, Wen-Hsiung Lu, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng | 2016-07-05 |
| 9373603 | Reflow process and tool | Ai-Tee Ang, Hsiu-Jen Lin, Cheng-Ting Chen, Ming-Da Cheng | 2016-06-21 |
| 9373610 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang | 2016-06-21 |
| 9373604 | Interconnect structures for wafer level package and methods of forming same | Chen-Hua Yu | 2016-06-21 |
| 9368398 | Interconnect structure and method of fabricating same | Wen-Hsiung Lu, Wei-Yu Chen, Hsuan-Ting Kuo, Ming-Da Cheng | 2016-06-14 |
| 9368462 | Methods and apparatus of packaging semiconductor devices | Yi-Wen Wu, Ming-Che Ho, Wen-Hsiung Lu, Chia-Wei Tu | 2016-06-14 |
| 9368460 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chien Ling Hwang +2 more | 2016-06-14 |
| 9368402 | Conductive line system and process | Yu Yi Huang, Hung-Jui Kuo | 2016-06-14 |
| 9362236 | Package structures and methods for forming the same | Hsien-Liang Meng, Wei-Hung Lin, Jimmy Liang, Ming-Che Ho, Hung-Jui Kuo +1 more | 2016-06-07 |
| 9355927 | Semiconductor packaging and manufacturing method thereof | Hsiu-Jen Lin, Wen-Hsiung Lu, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen +1 more | 2016-05-31 |
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Meng-Tse Chen, Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu +1 more | 2016-05-24 |
| 9343386 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2016-05-17 |
| 9331038 | Semiconductor interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung | 2016-05-03 |
| 9324670 | Semiconductor device with copper-tin compound on copper connector | Chien Ling Hwang, Yi-Li Hsiao | 2016-04-26 |
| 9324587 | Method for manufacturing semiconductor structure | Chen-Hua Yu, Chih-Fan Huang, Chun-Hung Lin, Ming-Da Cheng, Mirng-Ji Lii | 2016-04-26 |
| 9318386 | Wafer alignment methods in die sawing process | Yu-Hsiang Hu, Ming-Da Cheng | 2016-04-19 |