Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9521795 | Two-step direct bonding processes and tools for performing the same | Da-Yuan Shih, Chih-Hang Tung, Chen-Hua Yu | 2016-12-13 |
| 9498851 | Methods for forming apparatus for stud bump formation | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Chung-Shi Liu, Mirng-Ji Lii +1 more | 2016-11-22 |
| 9475145 | Solder bump joint in a device including lamellar structures | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Chih-Hang Tung, Da-Yuan Shih +1 more | 2016-10-25 |
| 9455183 | Semiconductor device and bump formation process | Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung, Cheng-Chang Wei | 2016-09-27 |
| 9343436 | Stacked package and method of manufacturing the same | Li-Yen Lin, Chih-Hang Tung | 2016-05-17 |
| 9324670 | Semiconductor device with copper-tin compound on copper connector | Chien Ling Hwang, Chung-Shi Liu | 2016-04-26 |
| 9263407 | Method for manufacturing a plurality of metal posts | Su-Chun Yang, Chih-Hang Tung, Da-Yuan Shih, Chen-Hua Yu | 2016-02-16 |