Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9475145 | Solder bump joint in a device including lamellar structures | Su-Chun Yang, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung, Da-Yuan Shih +1 more | 2016-10-25 |
CW
Chung-Jung Wu
Overall (2016): #434,712 of 481,213Top 95%
1
Patents 2016