Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9521795 | Two-step direct bonding processes and tools for performing the same | Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2016-12-13 |
| 9490408 | Injection molded microoptics | Lawrence Jacobowitz, Stephen L. Buchwalter, Casimer M. DeCusatis, Peter A. Gruber | 2016-11-08 |
| 9475145 | Solder bump joint in a device including lamellar structures | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Chih-Hang Tung +1 more | 2016-10-25 |
| 9404942 | Coaxial probe structure of elongated electrical conductors projecting from a support structure | Brian S. Beaman, Keith E. Fogel, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris | 2016-08-02 |
| 9343423 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Michael A. Gaynes, Jae-Woong Nah | 2016-05-17 |
| 9305896 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Michael A. Gaynes, Jae-Woong Nah | 2016-04-05 |
| 9263407 | Method for manufacturing a plurality of metal posts | Yi-Li Hsiao, Su-Chun Yang, Chih-Hang Tung, Chen-Hua Yu | 2016-02-16 |
| 9252120 | Copper post solder bumps on substrates | Jae-Woong Nah | 2016-02-02 |
| 9230932 | Interconnect crack arrestor structure and methods | Chen-Hua Yu | 2016-01-05 |