Issued Patents 2016
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508566 | Wafer level overmold for three dimensional surfaces | Paul S. Andry, Bing Dang, Eric P. Lewandowski, Bucknell C. Webb | 2016-11-29 |
| 9466590 | Optimized solder pads for microelectronic components | Tymon Barwicz, Yves Martin | 2016-10-11 |
| 9418976 | Chip stack with electrically insulating walls | Evan G. Colgan | 2016-08-16 |
| 9393633 | Method of joining a chip on a substrate | Pascal Blais, Paul F. Fortier, Kang-Wook Lee, Soojae Park, Robert L. Toutant +1 more | 2016-07-19 |
| 9343423 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Michael A. Gaynes, Da-Yuan Shih | 2016-05-17 |
| 9343420 | Universal solder joints for 3D packaging | Brian M. Erwin, Eric D. Perfecto, Nicholas A. Polomoff | 2016-05-17 |
| 9321245 | Injection of a filler material with homogeneous distribution of anisotropic filler particles through implosion | Michael A. Gaynes, Eric P. Lewandowski, Robert J. Polastre | 2016-04-26 |
| 9318641 | Nanowires formed by employing solder nanodots | Keith E. Fogel, Jeehwan Kim, Devendra K. Sadana, Kuen-Ting Shiu | 2016-04-19 |
| 9305896 | No flow underfill or wafer level underfill and solder columns | Claudius Ferger, Michael A. Gaynes, Da-Yuan Shih | 2016-04-05 |
| 9305866 | Intermetallic compound filled vias | Minhua Lu | 2016-04-05 |
| 9295166 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Paul A. Lauro | 2016-03-22 |
| 9275879 | Multi-chip module with rework capability | Michael A. Gaynes, Jeffrey D. Gelorme | 2016-03-01 |
| 9273408 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Michael A. Gaynes, Paul A. Lauro | 2016-03-01 |
| 9263378 | Ball grid array and land grid array assemblies fabricated using temporary resist | Charles L. Reynolds, Katsuyuki Sakuma | 2016-02-16 |
| 9252120 | Copper post solder bumps on substrates | Da-Yuan Shih | 2016-02-02 |
| 9231133 | Nanowires formed by employing solder nanodots | Keith E. Fogel, Jeehwan Kim, Devendra K. Sadana, Kuen-Ting Shiu | 2016-01-05 |