| 9531052 |
Semiconductor wafer having an integrated waveguide configured to communicate between first and second integrated circuit dies |
Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia |
2016-12-27 |
| 9508566 |
Wafer level overmold for three dimensional surfaces |
Paul S. Andry, Eric P. Lewandowski, Jae-Woong Nah, Bucknell C. Webb |
2016-11-29 |
| 9472789 |
Thin, flexible microsystem with integrated energy source |
Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Michael A. Gaynes, John U. Knickerbocker, Eric P. Lewandowski +2 more |
2016-10-18 |
| 9472859 |
Integration of area efficient antennas for phased array or wafer scale array antenna applications |
Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce, Cornelia K. Tsang |
2016-10-18 |
| 9433101 |
Substrate via filling |
Steven A. Cordes, Sung Kwon Kang, Yu Luo, Peter J. Sorce |
2016-08-30 |
| 9391040 |
Planarity-tolerant reworkable interconnect with integrated testing |
John U. Knickerbocker, Yang Liu, Yu Luo, Steven L. Wright |
2016-07-12 |
| 9364925 |
Assembly of electronic and optical devices |
Tymon Barwicz |
2016-06-14 |
| 9273408 |
Direct injection molded solder process for forming solder bumps on wafers |
Michael A. Gaynes, Paul A. Lauro, Jae-Woong Nah |
2016-03-01 |
| 9269561 |
Wafer debonding using long-wavelength infrared radiation ablation |
John U. Knickerbocker, Cornelia K. Tsang |
2016-02-23 |
