Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9531052 | Semiconductor wafer having an integrated waveguide configured to communicate between first and second integrated circuit dies | Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia | 2016-12-27 |
| 9508566 | Wafer level overmold for three dimensional surfaces | Paul S. Andry, Eric P. Lewandowski, Jae-Woong Nah, Bucknell C. Webb | 2016-11-29 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Michael A. Gaynes, John U. Knickerbocker, Eric P. Lewandowski +2 more | 2016-10-18 |
| 9472859 | Integration of area efficient antennas for phased array or wafer scale array antenna applications | Duixian Liu, Jean-Olivier Plouchart, Peter J. Sorce, Cornelia K. Tsang | 2016-10-18 |
| 9433101 | Substrate via filling | Steven A. Cordes, Sung Kwon Kang, Yu Luo, Peter J. Sorce | 2016-08-30 |
| 9391040 | Planarity-tolerant reworkable interconnect with integrated testing | John U. Knickerbocker, Yang Liu, Yu Luo, Steven L. Wright | 2016-07-12 |
| 9364925 | Assembly of electronic and optical devices | Tymon Barwicz | 2016-06-14 |
| 9273408 | Direct injection molded solder process for forming solder bumps on wafers | Michael A. Gaynes, Paul A. Lauro, Jae-Woong Nah | 2016-03-01 |
| 9269561 | Wafer debonding using long-wavelength infrared radiation ablation | John U. Knickerbocker, Cornelia K. Tsang | 2016-02-23 |