| 9502609 |
Simplified process for vertical LED manufacturing |
Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana |
2016-11-22 |
| 9502278 |
Substrate holder assembly for controlled layer transfer |
Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana |
2016-11-22 |
| 9455180 |
Controlled spalling of fine features |
Stephen W. Bedell, Ning Li, Devendra K. Sadana |
2016-09-27 |
| 9404942 |
Coaxial probe structure of elongated electrical conductors projecting from a support structure |
Brian S. Beaman, Keith E. Fogel, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih |
2016-08-02 |
| 9308714 |
Method for improving surface quality of spalled substrates |
Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana |
2016-04-12 |
| 9295166 |
Double solder bumps on substrates for low temperature flip chip bonding |
Peter A. Gruber, Jae-Woong Nah |
2016-03-22 |
| 9275867 |
Method for improving quality of spalled material layers |
Stephen W. Bedell, Keith E. Fogel, Ning Li, Devendra K. Sadana, Katherine L. Saenger +1 more |
2016-03-01 |
| 9273408 |
Direct injection molded solder process for forming solder bumps on wafers |
Bing Dang, Michael A. Gaynes, Jae-Woong Nah |
2016-03-01 |
| 9263363 |
Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive |
Gareth G. Hougham, Brian R. Sundlof, Jeffrey D. Gelorme |
2016-02-16 |
