Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9324601 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Paul S. Andry, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2016-04-26 |
| 9275879 | Multi-chip module with rework capability | Michael A. Gaynes, Jae-Woong Nah | 2016-03-01 |
| 9263363 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Paul A. Lauro, Brian R. Sundlof | 2016-02-16 |