| 9520779 |
Three-D power converter in three distinct strata |
Paul S. Andry, Leland Chang, Evan G. Colgan, Bucknell C. Webb, Robert L. Wisnieff |
2016-12-13 |
| 9472789 |
Thin, flexible microsystem with integrated energy source |
Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, Eric P. Lewandowski +2 more |
2016-10-18 |
| 9391040 |
Planarity-tolerant reworkable interconnect with integrated testing |
Bing Dang, Yang Liu, Yu Luo, Steven L. Wright |
2016-07-12 |
| 9324601 |
Low temperature adhesive resins for wafer bonding |
Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, Cornelia K. Tsang |
2016-04-26 |
| 9313921 |
Chip stack structures that implement two-phase cooling with radial flow |
Thomas J. Brunschwiler, Evan G. Colgan, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang |
2016-04-12 |
| 9312761 |
Three-D power converter in three distinct strata |
Paul S. Andry, Leland Chang, Evan G. Colgan, Bucknell C. Webb, Robert L. Wisnieff |
2016-04-12 |
| 9269561 |
Wafer debonding using long-wavelength infrared radiation ablation |
Bing Dang, Cornelia K. Tsang |
2016-02-23 |
