| 9520779 |
Three-D power converter in three distinct strata |
Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff |
2016-12-13 |
| 9508566 |
Wafer level overmold for three dimensional surfaces |
Bing Dang, Eric P. Lewandowski, Jae-Woong Nah, Bucknell C. Webb |
2016-11-29 |
| 9472789 |
Thin, flexible microsystem with integrated energy source |
Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker, Eric P. Lewandowski +2 more |
2016-10-18 |
| 9418895 |
Dies for RFID devices and sensor applications |
Robert L. Wisnieff |
2016-08-16 |
| 9412663 |
Dies for RFID devices and sensor applications |
Robert L. Wisnieff |
2016-08-09 |
| 9362223 |
Integrated circuit assembly with cushion polymer layer |
Sarah H. Knickerbocker, Ron R. Legario, Cornelia K. Tsang, Melvin P. Zussman |
2016-06-07 |
| 9331141 |
CMOS structure on replacement substrate |
Edmund J. Sprogis, Cornelia K. Tsang |
2016-05-03 |
| 9324601 |
Low temperature adhesive resins for wafer bonding |
Robert David Allen, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang |
2016-04-26 |
| 9312761 |
Three-D power converter in three distinct strata |
Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff |
2016-04-12 |
| 9299665 |
Formation of alpha particle shields in chip packaging |
Cyril Cabral, Jr., Kenneth P. Rodbell, Robert L. Wisnieff |
2016-03-29 |
