Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520779 | Three-D power converter in three distinct strata | Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff | 2016-12-13 |
| 9508566 | Wafer level overmold for three dimensional surfaces | Bing Dang, Eric P. Lewandowski, Jae-Woong Nah, Bucknell C. Webb | 2016-11-29 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker, Eric P. Lewandowski +2 more | 2016-10-18 |
| 9418895 | Dies for RFID devices and sensor applications | Robert L. Wisnieff | 2016-08-16 |
| 9412663 | Dies for RFID devices and sensor applications | Robert L. Wisnieff | 2016-08-09 |
| 9362223 | Integrated circuit assembly with cushion polymer layer | Sarah H. Knickerbocker, Ron R. Legario, Cornelia K. Tsang, Melvin P. Zussman | 2016-06-07 |
| 9331141 | CMOS structure on replacement substrate | Edmund J. Sprogis, Cornelia K. Tsang | 2016-05-03 |
| 9324601 | Low temperature adhesive resins for wafer bonding | Robert David Allen, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2016-04-26 |
| 9312761 | Three-D power converter in three distinct strata | Leland Chang, Evan G. Colgan, John U. Knickerbocker, Bucknell C. Webb, Robert L. Wisnieff | 2016-04-12 |
| 9299665 | Formation of alpha particle shields in chip packaging | Cyril Cabral, Jr., Kenneth P. Rodbell, Robert L. Wisnieff | 2016-03-29 |