| 9520779 |
Three-D power converter in three distinct strata |
Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Robert L. Wisnieff |
2016-12-13 |
| 9508566 |
Wafer level overmold for three dimensional surfaces |
Paul S. Andry, Bing Dang, Eric P. Lewandowski, Jae-Woong Nah |
2016-11-29 |
| 9495989 |
Laminating magnetic cores for on-chip magnetic devices |
Robert E. Fontana, Jr., William J. Gallagher, Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw +1 more |
2016-11-15 |
| 9472789 |
Thin, flexible microsystem with integrated energy source |
Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker +2 more |
2016-10-18 |
| 9406740 |
Silicon process compatible trench magnetic device |
Naigang Wang |
2016-08-02 |
| 9384879 |
Magnetic multilayer structure |
Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang |
2016-07-05 |
| 9324495 |
Planar inductors with closed magnetic loops |
Robert E. Fontana, Jr., William J. Gallagher, Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw +1 more |
2016-04-26 |
| 9312761 |
Three-D power converter in three distinct strata |
Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Robert L. Wisnieff |
2016-04-12 |
| 9257137 |
Magnetic writer having multiple gaps with more uniform magnetic fields across the gaps |
Robert G. Biskeborn, Philipp Herget |
2016-02-09 |
| 9245850 |
Through silicon via wafer, contacts and design structures |
Jeffrey P. Gambino, Cameron E. Luce, Daniel S. Vanslette |
2016-01-26 |
| 9245824 |
Through-vias for wiring layers of semiconductor devices |
Christopher V. Jahnes, Xiao Hu Liu |
2016-01-26 |
| 9236325 |
Through-vias for wiring layers of semicondutor devices |
Christopher V. Jahnes, Xiao Hu Liu |
2016-01-12 |
