Issued Patents 2016
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520779 | Three-D power converter in three distinct strata | Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Robert L. Wisnieff | 2016-12-13 |
| 9508566 | Wafer level overmold for three dimensional surfaces | Paul S. Andry, Bing Dang, Eric P. Lewandowski, Jae-Woong Nah | 2016-11-29 |
| 9495989 | Laminating magnetic cores for on-chip magnetic devices | Robert E. Fontana, Jr., William J. Gallagher, Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw +1 more | 2016-11-15 |
| 9472789 | Thin, flexible microsystem with integrated energy source | Paul S. Andry, Joana Sofia Branquinho Teresa Maria, Bing Dang, Michael A. Gaynes, John U. Knickerbocker +2 more | 2016-10-18 |
| 9406740 | Silicon process compatible trench magnetic device | Naigang Wang | 2016-08-02 |
| 9384879 | Magnetic multilayer structure | Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang | 2016-07-05 |
| 9324495 | Planar inductors with closed magnetic loops | Robert E. Fontana, Jr., William J. Gallagher, Philipp Herget, Eugene J. O'Sullivan, Lubomyr T. Romankiw +1 more | 2016-04-26 |
| 9312761 | Three-D power converter in three distinct strata | Paul S. Andry, Leland Chang, Evan G. Colgan, John U. Knickerbocker, Robert L. Wisnieff | 2016-04-12 |
| 9257137 | Magnetic writer having multiple gaps with more uniform magnetic fields across the gaps | Robert G. Biskeborn, Philipp Herget | 2016-02-09 |
| 9245850 | Through silicon via wafer, contacts and design structures | Jeffrey P. Gambino, Cameron E. Luce, Daniel S. Vanslette | 2016-01-26 |
| 9245824 | Through-vias for wiring layers of semiconductor devices | Christopher V. Jahnes, Xiao Hu Liu | 2016-01-26 |
| 9236325 | Through-vias for wiring layers of semicondutor devices | Christopher V. Jahnes, Xiao Hu Liu | 2016-01-12 |