Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455214 | Wafer frontside-backside through silicon via | Jeffrey C. Maling, Anthony K. Stamper, Zeljka Topic-Beganovic | 2016-09-27 |
| 9443764 | Method of eliminating poor reveal of through silicon vias | Jeffrey C. Maling, Anthony K. Stamper, Zeljka Topic-Beganovic | 2016-09-13 |
| 9406562 | Integrated circuit and design structure having reduced through silicon via-induced stress | Jeffrey P. Bonn, Brent A. Goplen, Brian L. Kinsman, Robert M. Rassel, Edmund J. Sprogis | 2016-08-02 |
| 9390969 | Integrated circuit and interconnect, and method of fabricating same | David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Matthew D. Moon, Eric J. White | 2016-07-12 |
| 9312426 | Structure with a metal silicide transparent conductive electrode and a method of forming the structure | Jeffrey P. Gambino, Derrick Liu | 2016-04-12 |
| 9245850 | Through silicon via wafer, contacts and design structures | Jeffrey P. Gambino, Cameron E. Luce, Bucknell C. Webb | 2016-01-26 |