| 9455214 |
Wafer frontside-backside through silicon via |
Jeffrey C. Maling, Anthony K. Stamper, Zeljka Topic-Beganovic |
2016-09-27 |
| 9443764 |
Method of eliminating poor reveal of through silicon vias |
Jeffrey C. Maling, Anthony K. Stamper, Zeljka Topic-Beganovic |
2016-09-13 |
| 9406562 |
Integrated circuit and design structure having reduced through silicon via-induced stress |
Jeffrey P. Bonn, Brent A. Goplen, Brian L. Kinsman, Robert M. Rassel, Edmund J. Sprogis |
2016-08-02 |
| 9390969 |
Integrated circuit and interconnect, and method of fabricating same |
David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Matthew D. Moon, Eric J. White |
2016-07-12 |
| 9312426 |
Structure with a metal silicide transparent conductive electrode and a method of forming the structure |
Jeffrey P. Gambino, Derrick Liu |
2016-04-12 |
| 9245850 |
Through silicon via wafer, contacts and design structures |
Jeffrey P. Gambino, Cameron E. Luce, Bucknell C. Webb |
2016-01-26 |
