Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9412736 | Embedding semiconductor devices in silicon-on-insulator wafers connected using through silicon vias | Yan Ding, Vibhor Jain, Thomas Kessler, Yves T. Ngu, Sebastian T. Ventrone | 2016-08-09 |
| 9406562 | Integrated circuit and design structure having reduced through silicon via-induced stress | Jeffrey P. Bonn, Brent A. Goplen, Brian L. Kinsman, Edmund J. Sprogis, Daniel S. Vanslette | 2016-08-02 |
| 9257324 | Forming structures on resistive substrates | Alan B. Botula, Renata Camillo-Castillo, James S. Dunn, Jeffrey P. Gambino, Douglas B. Hershberger +2 more | 2016-02-09 |