Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406562 | Integrated circuit and design structure having reduced through silicon via-induced stress | Jeffrey P. Bonn, Brent A. Goplen, Brian L. Kinsman, Robert M. Rassel, Daniel S. Vanslette | 2016-08-02 |
| 9385179 | Deep trench decoupling capacitor and methods of forming | James S. Nakos, Anthony K. Stamper | 2016-07-05 |
| 9368410 | Semiconductor devices having tensile and/or compressive stress and methods of manufacturing | Brent A. Anderson, Andres Bryant, Edward J. Nowak | 2016-06-14 |
| 9355936 | Flattened substrate surface for substrate bonding | Edward C. Cooney, III, James S. Dunn, Dale W. Martin, Charles S. Musante, BethAnn Rainey Lawrence +2 more | 2016-05-31 |
| 9331141 | CMOS structure on replacement substrate | Paul S. Andry, Cornelia K. Tsang | 2016-05-03 |