| 9524924 |
Dielectric cover for a through silicon via |
Daniel J. Couture, Jeffrey P. Gambino, Zhong-Xiang He |
2016-12-20 |
$17,295,000 |
| 9514987 |
Backside contact to final substrate |
Jeffrey P. Gambino, Mark D. Jaffe, Steven M. Shank |
2016-12-06 |
$2,582,000 |
| 9493341 |
Planar cavity MEMS and related structures, methods of manufacture and design structures |
John G. Twombly |
2016-11-15 |
$2,170,000 |
| 9496250 |
Tunable scaling of current gain in bipolar junction transistors |
Vibhor Jain, Alvin J. Joseph |
2016-11-15 |
$8,353,000 |
| 9496110 |
Micro-electro-mechanical system (MEMS) structure and design structures |
Ward Johnson, Jenifer E. Lary, Kimball M. Watson, Pui L. Yee |
2016-11-15 |
$8,353,000 |
| 9493343 |
Planar cavity MEMS and related structures, methods of manufacture and design structures |
Russell T. Herrin, Jeffrey C. Maling |
2016-11-15 |
$2,170,000 |
| 9478427 |
Semiconductor structures having low resistance paths throughout a wafer |
Jeffrey P. Gambino, Thomas J. Hartswick, Zhong-Xiang He, Eric J. White |
2016-10-25 |
$7,053,000 |
| 9461017 |
Electronic package that includes a plurality of integrated circuit devices bonded in a three-dimensional stack arrangement |
Mukta G. Farooq, John A. Fitzsimmons, Andrew H. Simon |
2016-10-04 |
$4,373,000 |
| 9455187 |
Backside device contact |
Jeffrey P. Gambino, Mark D. Jaffe, Steven M. Shank |
2016-09-27 |
$4,099,000 |
| 9455214 |
Wafer frontside-backside through silicon via |
Jeffrey C. Maling, Zeljka Topic-Beganovic, Daniel S. Vanslette |
2016-09-27 |
$3,712,000 |
| 9443764 |
Method of eliminating poor reveal of through silicon vias |
Jeffrey C. Maling, Zeljka Topic-Beganovic, Daniel S. Vanslette |
2016-09-13 |
$3,651,000 |
| 9424992 |
Complimentary metal-insulator-metal (MIM) capacitors and method of manufacture |
James S. Dunn, Zhong-Xiang He |
2016-08-23 |
$3,675,000 |
| 9425269 |
Replacement emitter for reduced contact resistance |
James W. Adkisson, Jeffrey P. Gambino |
2016-08-23 |
$3,675,000 |
| 9406472 |
Planar cavity MEMS and related structures, methods of manufacture and design structures |
Dinh Dang, Thai Doan, George A. Dunbar, III, Zhong-Xiang He, Russell T. Herrin +5 more |
2016-08-02 |
$3,259,000 |
| 9383404 |
High resistivity substrate final resistance test structure |
Jeffrey P. Gambino, Eric Johnson, Ian McCallum-Cook, Richard A. Phelps, Michael J. Zierak |
2016-07-05 |
$2,704,000 |
| 9385179 |
Deep trench decoupling capacitor and methods of forming |
James S. Nakos, Edmund J. Sprogis |
2016-07-05 |
$2,704,000 |
| 9385022 |
Silicon waveguide on bulk silicon substrate and methods of forming |
Mark D. Jaffe, Alvin J. Joseph, Qizhi Liu |
2016-07-05 |
$2,704,000 |
| 9352954 |
Planar cavity MEMS and related structures, methods of manufacture and design structures |
Christopher V. Jahnes |
2016-05-31 |
$4,553,000 |
| 9349793 |
Semiconductor structure with airgap |
Mark D. Jaffe, Alvin J. Joseph, Qizhi Liu |
2016-05-24 |
$3,942,000 |
| 9343255 |
Normally closed microelectromechanical switches (MEMS), methods of manufacture and design structures |
Dawn D. Hall, Mark C. H. Lamorey |
2016-05-17 |
$3,602,000 |
| 9330856 |
Methods of manufacture for micro-electro-mechanical system (MEMS) |
Russell T. Herrin, Jeffrey C. Maling |
2016-05-03 |
$3,695,000 |
| 9312140 |
Semiconductor structures having low resistance paths throughout a wafer |
Jeffrey P. Gambino, Thomas J. Hartswick, Zhong-Xiang He, Eric J. White |
2016-04-12 |
$2,843,000 |
| 9299765 |
Altering capacitance of MIM capacitor having reactive layer therein |
Daniel C. Edelstein |
2016-03-29 |
$707,000 |
| 9300272 |
Tunable filter structures and design structures |
James W. Adkisson, Panglijen Candra, Thomas J. Dunbar, Mark D. Jaffe, Robert K. Leidy |
2016-03-29 |
$707,000 |
| 9284185 |
Integrated circuit switches, design structure and methods of fabricating the same |
Felix P. Anderson, Thomas L. McDevitt, Julio C. Costa, Jonathan Hale Hammond |
2016-03-15 |
$907,000 |
