Issued Patents 2016
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524924 | Dielectric cover for a through silicon via | Daniel J. Couture, Jeffrey P. Gambino, Zhong-Xiang He | 2016-12-20 |
| 9514987 | Backside contact to final substrate | Jeffrey P. Gambino, Mark D. Jaffe, Steven M. Shank | 2016-12-06 |
| 9493341 | Planar cavity MEMS and related structures, methods of manufacture and design structures | John G. Twombly | 2016-11-15 |
| 9496250 | Tunable scaling of current gain in bipolar junction transistors | Vibhor Jain, Alvin J. Joseph | 2016-11-15 |
| 9496110 | Micro-electro-mechanical system (MEMS) structure and design structures | Ward Johnson, Jenifer E. Lary, Kimball M. Watson, Pui L. Yee | 2016-11-15 |
| 9493343 | Planar cavity MEMS and related structures, methods of manufacture and design structures | Russell T. Herrin, Jeffrey C. Maling | 2016-11-15 |
| 9478427 | Semiconductor structures having low resistance paths throughout a wafer | Jeffrey P. Gambino, Thomas J. Hartswick, Zhong-Xiang He, Eric J. White | 2016-10-25 |
| 9461017 | Electronic package that includes a plurality of integrated circuit devices bonded in a three-dimensional stack arrangement | Mukta G. Farooq, John A. Fitzsimmons, Andrew H. Simon | 2016-10-04 |
| 9455187 | Backside device contact | Jeffrey P. Gambino, Mark D. Jaffe, Steven M. Shank | 2016-09-27 |
| 9455214 | Wafer frontside-backside through silicon via | Jeffrey C. Maling, Zeljka Topic-Beganovic, Daniel S. Vanslette | 2016-09-27 |
| 9443764 | Method of eliminating poor reveal of through silicon vias | Jeffrey C. Maling, Zeljka Topic-Beganovic, Daniel S. Vanslette | 2016-09-13 |
| 9424992 | Complimentary metal-insulator-metal (MIM) capacitors and method of manufacture | James S. Dunn, Zhong-Xiang He | 2016-08-23 |
| 9425269 | Replacement emitter for reduced contact resistance | James W. Adkisson, Jeffrey P. Gambino | 2016-08-23 |
| 9406472 | Planar cavity MEMS and related structures, methods of manufacture and design structures | Dinh Dang, Thai Doan, George A. Dunbar, III, Zhong-Xiang He, Russell T. Herrin +5 more | 2016-08-02 |
| 9383404 | High resistivity substrate final resistance test structure | Jeffrey P. Gambino, Eric Johnson, Ian McCallum-Cook, Richard A. Phelps, Michael J. Zierak | 2016-07-05 |
| 9385179 | Deep trench decoupling capacitor and methods of forming | James S. Nakos, Edmund J. Sprogis | 2016-07-05 |
| 9385022 | Silicon waveguide on bulk silicon substrate and methods of forming | Mark D. Jaffe, Alvin J. Joseph, Qizhi Liu | 2016-07-05 |
| 9352954 | Planar cavity MEMS and related structures, methods of manufacture and design structures | Christopher V. Jahnes | 2016-05-31 |
| 9349793 | Semiconductor structure with airgap | Mark D. Jaffe, Alvin J. Joseph, Qizhi Liu | 2016-05-24 |
| 9343255 | Normally closed microelectromechanical switches (MEMS), methods of manufacture and design structures | Dawn D. Hall, Mark C. H. Lamorey | 2016-05-17 |
| 9330856 | Methods of manufacture for micro-electro-mechanical system (MEMS) | Russell T. Herrin, Jeffrey C. Maling | 2016-05-03 |
| 9312140 | Semiconductor structures having low resistance paths throughout a wafer | Jeffrey P. Gambino, Thomas J. Hartswick, Zhong-Xiang He, Eric J. White | 2016-04-12 |
| 9299765 | Altering capacitance of MIM capacitor having reactive layer therein | Daniel C. Edelstein | 2016-03-29 |
| 9300272 | Tunable filter structures and design structures | James W. Adkisson, Panglijen Candra, Thomas J. Dunbar, Mark D. Jaffe, Robert K. Leidy | 2016-03-29 |
| 9284185 | Integrated circuit switches, design structure and methods of fabricating the same | Felix P. Anderson, Thomas L. McDevitt, Julio C. Costa, Jonathan Hale Hammond | 2016-03-15 |