Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515051 | Metal to metal bonding for stacked (3D) integrated circuits | Tien-Jen Cheng, John A. Fitzsimmons | 2016-12-06 |
| 9490197 | Three dimensional organic or glass interposer | William Francis Landers, Jin Ping Liu, Andrew J. Martin, Kathryn E. Schlichting, Melissa A. Smith | 2016-11-08 |
| 9461017 | Electronic package that includes a plurality of integrated circuit devices bonded in a three-dimensional stack arrangement | John A. Fitzsimmons, Andrew H. Simon, Anthony K. Stamper | 2016-10-04 |
| 9404953 | Structures and methods for monitoring dielectric reliability with through-silicon vias | Fen Chen, John A. Griesemer, Chandrasekharan Kothandaraman, John M. Safran, Timothy D. Sullivan | 2016-08-02 |
| 9406561 | Three dimensional integrated circuit integration using dielectric bonding first and through via formation last | Robert Hannon, Subramanian S. Iyer, Emily R. Kinser | 2016-08-02 |
| 9401303 | Handler wafer removal by use of sacrificial inert layer | Kangguo Cheng, Jonathan E. Faltermeier, Wei Lin, Spyridon Skordas, Kevin R. Winstel | 2016-07-26 |
| 9401323 | Protected through semiconductor via (TSV) | Jennifer A. Oakley, Kevin S. Petrarca, Richard P. Volant | 2016-07-26 |
| 9330946 | Method and structure of die stacking using pre-applied underfill | Michael A. Gaynes, Katsuyuki Sakuma | 2016-05-03 |
| 9263386 | Forming BEOL line fuse structure | Emily R. Kinser | 2016-02-16 |
| 9263324 | 3-D integration using multi stage vias | Troy L. Graves-Abe | 2016-02-16 |
| 9257336 | Bottom-up plating of through-substrate vias | John A. Fitzsimmons, Troy L. Graves-Abe | 2016-02-09 |
| 9257361 | In-situ thermoelectric cooling | Emily R. Kinser, JoAnn M. Rolick-DiGiacomio, Charu Tejwani | 2016-02-09 |
| 9252133 | Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures | Christopher N. Collins, Troy L. Graves-Abe, Joyce C. Liu, Gerd Pfeiffer, Thuy L. Tran-Quinn | 2016-02-02 |