Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406561 | Three dimensional integrated circuit integration using dielectric bonding first and through via formation last | Mukta G. Farooq, Subramanian S. Iyer, Emily R. Kinser | 2016-08-02 |