Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406561 | Three dimensional integrated circuit integration using dielectric bonding first and through via formation last | Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer | 2016-08-02 |
| 9263386 | Forming BEOL line fuse structure | Mukta G. Farooq | 2016-02-16 |
| 9257361 | In-situ thermoelectric cooling | Mukta G. Farooq, JoAnn M. Rolick-DiGiacomio, Charu Tejwani | 2016-02-09 |
| 9249015 | Mold for forming complex 3D MEMS components | Jan Schroers, Golden Kumar | 2016-02-02 |