| 9502350 |
Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig |
2016-11-22 |
| 9461017 |
Electronic package that includes a plurality of integrated circuit devices bonded in a three-dimensional stack arrangement |
Mukta G. Farooq, John A. Fitzsimmons, Anthony K. Stamper |
2016-10-04 |
| 9455186 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more |
2016-09-27 |
| 9431346 |
Graphene-metal E-fuse |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew Tae Kim +1 more |
2016-08-30 |
| 9431292 |
Alternate dual damascene method for forming interconnects |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig |
2016-08-30 |
| 9425144 |
Metal fuse structure for improved programming capability |
Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +2 more |
2016-08-23 |
| 9412658 |
Constrained nanosecond laser anneal of metal interconnect structures |
Oleg Gluschenkov, Siddarth A. Krishnan, Joyeeta Nag, Shishir Ray |
2016-08-09 |
| 9406560 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more |
2016-08-02 |
| 9385038 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more |
2016-07-05 |
| 9360525 |
Stacked via structure for metal fuse applications |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +1 more |
2016-06-07 |
| 9324655 |
Modified via bottom for beol via efuse |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig |
2016-04-26 |
| 9293412 |
Graphene and metal interconnects with reduced contact resistance |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig |
2016-03-22 |
| 9257391 |
Hybrid graphene-metal interconnect structures |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig |
2016-02-09 |
