Issued Patents 2016
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524916 | Structures and methods for determining TDDB reliability at reduced spacings using the structures | Erdem Kaltalioglu, Naftali E. Lustig, Ping-Chuan Wang, Lijuan Zhang | 2016-12-20 |
| 9502350 | Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer | Griselda Bonilla, Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2016-11-22 |
| 9478509 | Mechanically anchored backside C4 pad | Erdem Kaltalioglu, Andrew Tae Kim, Ping-Chuan Wang, Lijuan Zhang | 2016-10-25 |
| 9455186 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more | 2016-09-27 |
| 9443776 | Method and structure for determining thermal cycle reliability | Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2016-09-13 |
| 9431293 | Selective local metal cap layer formation for improved electromigration behavior | Erdem Kaltalioglu, Ping-Chuan Wang, Lijuan Zhang | 2016-08-30 |
| 9431346 | Graphene-metal E-fuse | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Andrew Tae Kim, Naftali E. Lustig +1 more | 2016-08-30 |
| 9431292 | Alternate dual damascene method for forming interconnects | Griselda Bonilla, Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2016-08-30 |
| 9425144 | Metal fuse structure for improved programming capability | Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Stephan Grunow, Naftali E. Lustig +2 more | 2016-08-23 |
| 9406560 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more | 2016-08-02 |
| 9385038 | Selective local metal cap layer formation for improved electromigration behavior | Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more | 2016-07-05 |
| 9360525 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Stephan Grunow, Naftali E. Lustig, Andrew H. Simon +1 more | 2016-06-07 |
| 9324655 | Modified via bottom for beol via efuse | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Naftali E. Lustig, Andrew H. Simon | 2016-04-26 |
| 9305879 | E-fuse with hybrid metallization | Erdem Kaltalioglu, Andrew Tae Kim, Ping-Chuan Wang, Lijuan Zhang | 2016-04-05 |
| 9293412 | Graphene and metal interconnects with reduced contact resistance | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Naftali E. Lustig, Andrew H. Simon | 2016-03-22 |
| 9287186 | Method and structure for determining thermal cycle reliability | Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray, Hazara S. Rathore +2 more | 2016-03-15 |
| 9257391 | Hybrid graphene-metal interconnect structures | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Naftali E. Lustig, Andrew H. Simon | 2016-02-09 |