| 9524930 |
Configurable interposer |
Oleg Gluschenkov, Yunsheng Song, Tso-Hui Ting |
2016-12-20 |
| 9524916 |
Structures and methods for determining TDDB reliability at reduced spacings using the structures |
Ronald G. Filippi, Erdem Kaltalioglu, Naftali E. Lustig, Lijuan Zhang |
2016-12-20 |
| 9478509 |
Mechanically anchored backside C4 pad |
Ronald G. Filippi, Erdem Kaltalioglu, Andrew Tae Kim, Lijuan Zhang |
2016-10-25 |
| 9443776 |
Method and structure for determining thermal cycle reliability |
Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more |
2016-09-13 |
| 9435852 |
Integrated circuit (IC) test structure with monitor chain and test wires |
Andrew Tae Kim, Cathryn J. Christiansen |
2016-09-06 |
| 9431293 |
Selective local metal cap layer formation for improved electromigration behavior |
Ronald G. Filippi, Erdem Kaltalioglu, Lijuan Zhang |
2016-08-30 |
| 9391014 |
Physical unclonable interconnect function array |
Kai D. Feng, Wai-Kin Li, Zhijian Yang |
2016-07-12 |
| 9391030 |
On-chip semiconductor device having enhanced variability |
Wai-Kin Li, Chengwen Pei |
2016-07-12 |
| 9360525 |
Stacked via structure for metal fuse applications |
Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +1 more |
2016-06-07 |
| 9354252 |
Pressure sensing and control for semiconductor wafer probing |
Robert D. Edwards, Oleg Gluschenkov, Louis V. Medina, Tso-Hui Ting, Yongchun Xin |
2016-05-31 |
| 9349661 |
Wafer thinning endpoint detection for TSV technology |
Hanyi Ding, Oleg Gluschenkov, Lin Zhou |
2016-05-24 |
| 9331012 |
Method for fabricating a physical unclonable interconnect function array |
Kai D. Feng, Wai-Kin Li, Zhijian Yang |
2016-05-03 |
| 9318414 |
Integrated circuit structure with through-semiconductor via |
Fen Chen, Minhua Lu, Timothy D. Sullivan, Lijuan Zhang |
2016-04-19 |
| 9318413 |
Integrated circuit structure with metal cap and methods of fabrication |
Fen Chen, Andrew Tae Kim, Minhua Lu, Timothy D. Sullivan, Lijuan Zhang |
2016-04-19 |
| 9305879 |
E-fuse with hybrid metallization |
Ronald G. Filippi, Erdem Kaltalioglu, Andrew Tae Kim, Lijuan Zhang |
2016-04-05 |
| 9287186 |
Method and structure for determining thermal cycle reliability |
Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more |
2016-03-15 |
| 9281236 |
Embedded on-chip security |
Kai D. Feng, Wai-Kin Li, Zhijian Yang |
2016-03-08 |
| 9262467 |
Enforcing temporal uniqueness of index keys utilizing key-valued locking in the presence of pseudo-deleted keys |
Robert W. Lyle |
2016-02-16 |
| 9252794 |
Frequency calibration with real-time resistor trimming |
Kai D. Feng, David R. Hanson, Chengwen Pei |
2016-02-02 |
| 9240406 |
Precision trench capacitor |
Kai D. Feng, Dan Moy, Chengwen Pei, Robert R. Robison, Pinping Sun +1 more |
2016-01-19 |
