Issued Patents 2016
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524930 | Configurable interposer | Oleg Gluschenkov, Yunsheng Song, Tso-Hui Ting | 2016-12-20 |
| 9524916 | Structures and methods for determining TDDB reliability at reduced spacings using the structures | Ronald G. Filippi, Erdem Kaltalioglu, Naftali E. Lustig, Lijuan Zhang | 2016-12-20 |
| 9478509 | Mechanically anchored backside C4 pad | Ronald G. Filippi, Erdem Kaltalioglu, Andrew Tae Kim, Lijuan Zhang | 2016-10-25 |
| 9443776 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2016-09-13 |
| 9435852 | Integrated circuit (IC) test structure with monitor chain and test wires | Andrew Tae Kim, Cathryn J. Christiansen | 2016-09-06 |
| 9431293 | Selective local metal cap layer formation for improved electromigration behavior | Ronald G. Filippi, Erdem Kaltalioglu, Lijuan Zhang | 2016-08-30 |
| 9391014 | Physical unclonable interconnect function array | Kai D. Feng, Wai-Kin Li, Zhijian Yang | 2016-07-12 |
| 9391030 | On-chip semiconductor device having enhanced variability | Wai-Kin Li, Chengwen Pei | 2016-07-12 |
| 9360525 | Stacked via structure for metal fuse applications | Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +1 more | 2016-06-07 |
| 9354252 | Pressure sensing and control for semiconductor wafer probing | Robert D. Edwards, Oleg Gluschenkov, Louis V. Medina, Tso-Hui Ting, Yongchun Xin | 2016-05-31 |
| 9349661 | Wafer thinning endpoint detection for TSV technology | Hanyi Ding, Oleg Gluschenkov, Lin Zhou | 2016-05-24 |
| 9331012 | Method for fabricating a physical unclonable interconnect function array | Kai D. Feng, Wai-Kin Li, Zhijian Yang | 2016-05-03 |
| 9318414 | Integrated circuit structure with through-semiconductor via | Fen Chen, Minhua Lu, Timothy D. Sullivan, Lijuan Zhang | 2016-04-19 |
| 9318413 | Integrated circuit structure with metal cap and methods of fabrication | Fen Chen, Andrew Tae Kim, Minhua Lu, Timothy D. Sullivan, Lijuan Zhang | 2016-04-19 |
| 9305879 | E-fuse with hybrid metallization | Ronald G. Filippi, Erdem Kaltalioglu, Andrew Tae Kim, Lijuan Zhang | 2016-04-05 |
| 9287186 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2016-03-15 |
| 9281236 | Embedded on-chip security | Kai D. Feng, Wai-Kin Li, Zhijian Yang | 2016-03-08 |
| 9262467 | Enforcing temporal uniqueness of index keys utilizing key-valued locking in the presence of pseudo-deleted keys | Robert W. Lyle | 2016-02-16 |
| 9252794 | Frequency calibration with real-time resistor trimming | Kai D. Feng, David R. Hanson, Chengwen Pei | 2016-02-02 |
| 9240406 | Precision trench capacitor | Kai D. Feng, Dan Moy, Chengwen Pei, Robert R. Robison, Pinping Sun +1 more | 2016-01-19 |