Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524916 | Structures and methods for determining TDDB reliability at reduced spacings using the structures | Ronald G. Filippi, Naftali E. Lustig, Ping-Chuan Wang, Lijuan Zhang | 2016-12-20 |
| 9478509 | Mechanically anchored backside C4 pad | Ronald G. Filippi, Andrew Tae Kim, Ping-Chuan Wang, Lijuan Zhang | 2016-10-25 |
| 9431293 | Selective local metal cap layer formation for improved electromigration behavior | Ronald G. Filippi, Ping-Chuan Wang, Lijuan Zhang | 2016-08-30 |
| 9373596 | Passivated copper chip pads | Thomas Goebel, Markus Naujok | 2016-06-21 |
| 9330974 | Through level vias and methods of formation thereof | Sunoo Kim, Muhammed Shafi Pallachalil, Moosung Chae | 2016-05-03 |
| 9305879 | E-fuse with hybrid metallization | Ronald G. Filippi, Andrew Tae Kim, Ping-Chuan Wang, Lijuan Zhang | 2016-04-05 |