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Naftali E. Lustig — 12 Patents in 2016

IBM: 7 patents #605 of 10,295Top 6%

Globalfoundries: 5 patents #156 of 2,145Top 8%

Ossining, NY: #5 of 90 inventorsTop 6%

New York: #210 of 11,723 inventorsTop 2%

Overall (2016): #4,346 of 481,213Top 1%

12 Patents 2016

Issued Patents 2016

Showing 1–12 of 12 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9524916	Structures and methods for determining TDDB reliability at reduced spacings using the structures	Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang, Lijuan Zhang	2016-12-20	$6,917,000
9502350	Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer	Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon	2016-11-22	$3,414,000
9455186	Selective local metal cap layer formation for improved electromigration behavior	Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more	2016-09-27	$4,099,000
9431292	Alternate dual damascene method for forming interconnects	Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Andrew H. Simon	2016-08-30	$3,218,000
9431346	Graphene-metal E-fuse	Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew Tae Kim +1 more	2016-08-30	$3,218,000
9425144	Metal fuse structure for improved programming capability	Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +2 more	2016-08-23	$3,675,000
9406560	Selective local metal cap layer formation for improved electromigration behavior	Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more	2016-08-02	$5,615,000
9385038	Selective local metal cap layer formation for improved electromigration behavior	Matthew S. Angyal, Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp +4 more	2016-07-05	$5,294,000
9360525	Stacked via structure for metal fuse applications	Griselda Bonilla, Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Andrew H. Simon +1 more	2016-06-07	$4,256,000
9324655	Modified via bottom for beol via efuse	Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon	2016-04-26	$1,566,000
9293412	Graphene and metal interconnects with reduced contact resistance	Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon	2016-03-22	$2,974,000
9257391	Hybrid graphene-metal interconnect structures	Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Andrew H. Simon	2016-02-09	$571,000