| 9502350 |
Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layer |
Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon |
2016-11-22 |
| 9472477 |
Electromigration test structure for Cu barrier integrity and blech effect evaluations |
Elbert E. Huang, Chao-Kun Hu, Baozhen Li, Paul S. McLaughlin |
2016-10-18 |
| 9472450 |
Graphene cap for copper interconnect structures |
Christos D. Dimitrakopoulos, Alfred Grill, James B. Hannon, Qinghuang Lin, Deborah A. Neumayer +3 more |
2016-10-18 |
| 9455186 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more |
2016-09-27 |
| 9431292 |
Alternate dual damascene method for forming interconnects |
Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon |
2016-08-30 |
| 9431346 |
Graphene-metal E-fuse |
Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Andrew Tae Kim, Naftali E. Lustig +1 more |
2016-08-30 |
| 9425144 |
Metal fuse structure for improved programming capability |
Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig +2 more |
2016-08-23 |
| 9406560 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more |
2016-08-02 |
| 9385038 |
Selective local metal cap layer formation for improved electromigration behavior |
Matthew S. Angyal, Junjing Bao, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more |
2016-07-05 |
| 9360525 |
Stacked via structure for metal fuse applications |
Kaushik Chanda, Ronald G. Filippi, Stephan Grunow, Naftali E. Lustig, Andrew H. Simon +1 more |
2016-06-07 |
| 9324655 |
Modified via bottom for beol via efuse |
Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon |
2016-04-26 |
| 9293412 |
Graphene and metal interconnects with reduced contact resistance |
Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon |
2016-03-22 |
| 9287185 |
Determining appropriateness of sampling integrated circuit test data in the presence of manufacturing variations |
Baozhen Li, Barry P. Linder, James H. Stathis, Ernest Y. Wu, Kai Zhao |
2016-03-15 |
| 9257391 |
Hybrid graphene-metal interconnect structures |
Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon |
2016-02-09 |
