Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472477 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Chao-Kun Hu, Baozhen Li | 2016-10-18 |
| 9443776 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore +2 more | 2016-09-13 |
| 9287186 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Conal E. Murray, Hazara S. Rathore +2 more | 2016-03-15 |