Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514981 | Interconnect structure | Dinesh A. Badami, Wen Liu, Chih-Chao Yang | 2016-12-06 |
| 9489482 | Reliability-optimized selective voltage binning | Jeanne P. Bickford, Nazmul Habib, Tad J. Wilder | 2016-11-08 |
| 9472477 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Chao-Kun Hu, Paul S. McLaughlin | 2016-10-18 |
| 9406617 | Structure and process for W contacts | Daniel C. Edelstein, Chih-Chao Yang | 2016-08-02 |
| 9362229 | Semiconductor devices with enhanced electromigration performance | Jeffrey P. Gambino, David L. Harame, Timothy D. Sullivan, Bjorn K. A. Zetterlund | 2016-06-07 |
| 9354953 | System integrator and system integration method with reliability optimized integrated circuit chip selection | Jeanne P. Bickford, Nazmul Habib | 2016-05-31 |
| 9312203 | Dual damascene structure with liner | Chih-Chao Yang | 2016-04-12 |
| 9287185 | Determining appropriateness of sampling integrated circuit test data in the presence of manufacturing variations | Griselda Bonilla, Barry P. Linder, James H. Stathis, Ernest Y. Wu, Kai Zhao | 2016-03-15 |