| 9508647 |
Single damascene interconnect structure |
Shyng-Tsong Chen, Takeshi Nogami |
2016-11-29 |
| 9496239 |
Nitride-enriched oxide-to-oxide 3D wafer bonding |
Chih-Chao Yang |
2016-11-15 |
| 9472503 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects |
Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more |
2016-10-18 |
| 9455182 |
Interconnect structure with capping layer and barrier layer |
Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha |
2016-09-27 |
| 9425298 |
Lateral bipolar transistor |
Fabio Carta, Stephen M. Gates, Bahman Hekmatshoartabari, Tak H. Ning |
2016-08-23 |
| 9406617 |
Structure and process for W contacts |
Baozhen Li, Chih-Chao Yang |
2016-08-02 |
| 9332628 |
Microelectronic structure including air gap |
David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth +1 more |
2016-05-03 |
| 9324650 |
Interconnect structures with fully aligned vias |
Nicholas C. M. Fuller, Elbert E. Huang, Satyanarayana V. Nitta, David L. Rath |
2016-04-26 |
| 9318415 |
Beol structures incorporating active devices and mechanical strength |
Stephen M. Gates, Satyanarayana V. Nitta |
2016-04-19 |
| 9299765 |
Altering capacitance of MIM capacitor having reactive layer therein |
Anthony K. Stamper |
2016-03-29 |
| 9275952 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects |
Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more |
2016-03-01 |
| 9275936 |
BEOL structures incorporating active devices and mechanical strength |
Stephen M. Gates, Satyanarayana V. Nitta |
2016-03-01 |
| 9245794 |
Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application |
Chih-Chao Yang, Takeshi Nogami |
2016-01-26 |
