Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508647 | Single damascene interconnect structure | Shyng-Tsong Chen, Daniel C. Edelstein | 2016-11-29 |
| 9472503 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Deepika Priyadarshini +1 more | 2016-10-18 |
| 9455182 | Interconnect structure with capping layer and barrier layer | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2016-09-27 |
| 9379057 | Method and structure to reduce the electric field in semiconductor wiring interconnects | Elbert E. Huang, Raghuveer R. Patlolla, Christopher J. Penny, Theodorus E. Standaert | 2016-06-28 |
| 9332628 | Microelectronic structure including air gap | Daniel C. Edelstein, David V. Horak, Elbert E. Huang, Satyanarayana V. Nitta, Shom Ponoth +1 more | 2016-05-03 |
| 9312224 | Interconnect structure containing a porous low k interconnect dielectric/dielectric cap | Donald F. Canaperi, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Deepika Priyadarshini +2 more | 2016-04-12 |
| 9275952 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Deepika Priyadarshini +1 more | 2016-03-01 |
| 9263389 | Enhancing barrier in air gap technology | Wei Lin | 2016-02-16 |
| 9245794 | Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application | Chih-Chao Yang, Daniel C. Edelstein | 2016-01-26 |