Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508647 | Single damascene interconnect structure | Daniel C. Edelstein, Takeshi Nogami | 2016-11-29 |
| 9490168 | Via formation using sidewall image transfer process to define lateral dimension | Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Yann Mignot, Hosadurga Shobha +3 more | 2016-11-08 |