| 9508560 |
SiARC removal with plasma etch and fluorinated wet chemical solution combination |
Brown C. Peethala, Shariq Siddiqui |
2016-11-29 |
| 9490168 |
Via formation using sidewall image transfer process to define lateral dimension |
Shyng-Tsong Chen, Cheng Chi, Chi-Chun Liu, Sylvie Mignot, Hosadurga Shobha +3 more |
2016-11-08 |
| 9466563 |
Interconnect structure for an integrated circuit and method of fabricating an interconnect structure |
Terry A. Spooner, James J. Kelly |
2016-10-11 |
| 9390967 |
Method for residue-free block pattern transfer onto metal interconnects for air gap formation |
Joe Lee, Brown C. Peethala |
2016-07-12 |
| 9385078 |
Self aligned via in integrated circuit |
Yannick Feurprier, Joe Lee, Lars Liebmann, Terry A. Spooner, Douglas M. Trickett +1 more |
2016-07-05 |
| 9373582 |
Self aligned via in integrated circuit |
Yannick Feurprier, Joe Lee, Lars Liebmann, Terry A. Spooner, Douglas M. Trickett +1 more |
2016-06-21 |
| 9252051 |
Method for top oxide rounding with protection of patterned features |
Joe Lee, Douglas M. Trickett |
2016-02-02 |
