Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9390967 | Method for residue-free block pattern transfer onto metal interconnects for air gap formation | Yann Mignot, Brown C. Peethala | 2016-07-12 |
| 9385078 | Self aligned via in integrated circuit | Yannick Feurprier, Lars Liebmann, Yann Mignot, Terry A. Spooner, Douglas M. Trickett +1 more | 2016-07-05 |
| 9373582 | Self aligned via in integrated circuit | Yannick Feurprier, Lars Liebmann, Yann Mignot, Terry A. Spooner, Douglas M. Trickett +1 more | 2016-06-21 |
| 9349687 | Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect | Stephen M. Gates, Elbert E. Huang, Son V. Nguyen, Brown C. Peethala, Christopher J. Penny +1 more | 2016-05-24 |
| 9252051 | Method for top oxide rounding with protection of patterned features | Yann Mignot, Douglas M. Trickett | 2016-02-02 |