SN

Son V. Nguyen

IBM: 10 patents #357 of 10,295Top 4%
EL Edwards Lifesciences: 2 patents #27 of 146Top 20%
Globalfoundries: 2 patents #439 of 2,145Top 25%
Overall (2016): #3,033 of 481,213Top 1%
14
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9502288 Method of forming an interconnect structure Alfred Grill, Thomas J. Haigh, Jr., Hosadurga Shobha, Tuan A. Vo 2016-11-22
9472503 Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Takeshi Nogami, Deepika Priyadarshini +1 more 2016-10-18
9455182 Interconnect structure with capping layer and barrier layer Daniel C. Edelstein, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha 2016-09-27
9449812 Hydrogen-free silicon-based deposited dielectric films for nano device fabrication Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Deepika Priyadarshini, Hosadurga Shobha +1 more 2016-09-20
9449810 Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors Donald F. Canaperi, Deepika Priyadarshini, Hosadurga Shobha 2016-09-20
9435031 Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same Alfred Grill, Deepika Priyadarshini 2016-09-06
9431235 Multilayer dielectric structures with graded composition for nano-scale semiconductor devices Deepika Priyadarshini 2016-08-30
9412629 Wafer bonding for 3D device packaging fabrication Vamsi K. Paruchuri, Deepika Priyadarshini, Tuan A. Vo 2016-08-09
9393110 Prosthetic heart valve Tamir S. Levi, Netanel Benichou, David Maimon, Ziv Yohanan, Nikolay Gurovich +4 more 2016-07-19
9349687 Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect Stephen M. Gates, Elbert E. Huang, Joe Lee, Brown C. Peethala, Christopher J. Penny +1 more 2016-05-24
9312224 Interconnect structure containing a porous low k interconnect dielectric/dielectric cap Donald F. Canaperi, Alfred Grill, Thomas J. Haigh, Jr., Takeshi Nogami, Deepika Priyadarshini +2 more 2016-04-12
9275952 Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Takeshi Nogami, Deepika Priyadarshini +1 more 2016-03-01
9263366 Liquid cooling of semiconductor chips utilizing small scale structures Wei Lin, Spyridon Skordas, Tuan A. Vo 2016-02-16
9241792 Two-step heart valve implantation Netanel Benichou, Benjamin Spenser 2016-01-26