| 9502288 |
Method of forming an interconnect structure |
Son V. Nguyen, Thomas J. Haigh, Jr., Hosadurga Shobha, Tuan A. Vo |
2016-11-22 |
| 9484403 |
Boron rich nitride cap for total ionizing dose mitigation in SOI devices |
Deborah A. Neumayer, Kenneth P. Rodbell |
2016-11-01 |
| 9472503 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects |
Donald F. Canaperi, Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more |
2016-10-18 |
| 9472450 |
Graphene cap for copper interconnect structures |
Griselda Bonilla, Christos D. Dimitrakopoulos, James B. Hannon, Qinghuang Lin, Deborah A. Neumayer +3 more |
2016-10-18 |
| 9449812 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication |
Donald F. Canaperi, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more |
2016-09-20 |
| 9435031 |
Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same |
Son V. Nguyen, Deepika Priyadarshini |
2016-09-06 |
| 9431520 |
Graphene nanoribbons and carbon nanotubes fabricated from SiC fins or nanowire templates |
Guy M. Cohen, Christos D. Dimitrakopoulos |
2016-08-30 |
| 9397195 |
Graphene nanoribbons and carbon nanotubes fabricated from SiC fins or nanowire templates |
Guy M. Cohen, Christos D. Dimitrakopoulos |
2016-07-19 |
| 9337026 |
Graphene growth on a carbon-containing semiconductor layer |
Jack O. Chu, Christos D. Dimitrakopoulos, Chun-Yung Sung |
2016-05-10 |
| 9312224 |
Interconnect structure containing a porous low k interconnect dielectric/dielectric cap |
Donald F. Canaperi, Thomas J. Haigh, Jr., Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +2 more |
2016-04-12 |
| 9293557 |
Low temperature spacer for advanced semiconductor devices |
Kevin K. Chan, Deborah A. Neumayer, Dae-Gyu Park, Norma E. Sosa, Min Yang |
2016-03-22 |
| 9275952 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects |
Donald F. Canaperi, Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more |
2016-03-01 |
| 9236250 |
Formation of a graphene layer on a large substrate |
Jack O. Chu, Christos D. Dimitrakopoulos, Marcus O. Freitag, Timothy J. McArdle, Robert L. Wisnieff |
2016-01-12 |
| 9231063 |
Boron rich nitride cap for total ionizing dose mitigation in SOI devices |
Deborah A. Neumayer, Kenneth P. Rodbell |
2016-01-05 |
