DP

Deepika Priyadarshini

IBM: 10 patents #357 of 10,295Top 4%
Globalfoundries: 1 patents #828 of 2,145Top 40%
Overall (2016): #5,707 of 481,213Top 2%
11
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9472503 Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami +1 more 2016-10-18
9455182 Interconnect structure with capping layer and barrier layer Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha 2016-09-27
9449812 Hydrogen-free silicon-based deposited dielectric films for nano device fabrication Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Hosadurga Shobha +1 more 2016-09-20
9449810 Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors Donald F. Canaperi, Son V. Nguyen, Hosadurga Shobha 2016-09-20
9435031 Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same Alfred Grill, Son V. Nguyen 2016-09-06
9431235 Multilayer dielectric structures with graded composition for nano-scale semiconductor devices Son V. Nguyen 2016-08-30
9412629 Wafer bonding for 3D device packaging fabrication Son V. Nguyen, Vamsi K. Paruchuri, Tuan A. Vo 2016-08-09
9349687 Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect Stephen M. Gates, Elbert E. Huang, Joe Lee, Son V. Nguyen, Brown C. Peethala +1 more 2016-05-24
9312224 Interconnect structure containing a porous low k interconnect dielectric/dielectric cap Donald F. Canaperi, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Takeshi Nogami +2 more 2016-04-12
9305836 Air gap semiconductor structure with selective cap bilayer Stephen M. Gates, Elbert E. Huang, Dimitri Kioussis, Christopher J. Penny 2016-04-05
9275952 Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami +1 more 2016-03-01