Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9472457 | Manganese oxide hard mask for etching dielectric materials | Spyridon Skordas, Tuan A. Vo | 2016-10-18 | $1,445,000 |
| 9466538 | Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process | Spyridon Skordas, Subramanian S. Iyer, Donald F. Canaperi, Shidong Li | 2016-10-11 | $4,519,000 |
| 9401303 | Handler wafer removal by use of sacrificial inert layer | Kangguo Cheng, Jonathan E. Faltermeier, Mukta G. Farooq, Spyridon Skordas, Kevin R. Winstel | 2016-07-26 | $8,130,000 |
| 9263366 | Liquid cooling of semiconductor chips utilizing small scale structures | Son V. Nguyen, Spyridon Skordas, Tuan A. Vo | 2016-02-16 | $2,821,000 |
| 9263389 | Enhancing barrier in air gap technology | Takeshi Nogami | 2016-02-16 | $2,821,000 |