Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9466538 | Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process | Spyridon Skordas, Subramanian S. Iyer, Donald F. Canaperi, Wei Lin | 2016-10-11 |
| 9443799 | Interposer with lattice construction and embedded conductive metal structures | Jean Audet, Benjamin V. Fasano | 2016-09-13 |
| 9293439 | Electronic module assembly with patterned adhesive array | Edmund Blackshear, Elaine Cyr, Benjamin V. Fasano, Paul F. Fortier, Marcus E. Interrante +4 more | 2016-03-22 |